INDUSTRY ANALYSIS

ABF Package Substrates analysis

Explore companies, technologies and supply chains. English translations are published in batches, with the original sources and dates preserved.

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English edition 2026-10-29 · Updated 2026-10-29

TPCA Show 2026: Physical Limits, Supply-Chain Beneficiaries, and Competition in Taiwan’s NT$1 Trillion PCB Industry

Taiwan’s PCB production value is projected to exceed NT$1.13 trillion in 2026. Drawing on the technologies and executive warnings presented at TPCA Show 2026, this article examines which supply-chain segments stand to benefit from physical material bottlenecks…

ABF Build-up FilmABF Package SubstratesCopper-Clad LaminateFlex and Rigid-Flex PCBsElectronic Glass ClothHigh-Density Interconnect PCBsHigh-Layer-Count PCBsMultilayer Rigid PCBsPrinted Circuit BoardsPCB Drills and RoutersCCL Resin SystemsIC Package Substrates

English edition 2026-10-06 · Updated 2026-10-06

HBM4 and HBM4E Technology and Supply Chains: How the Three Major Suppliers Combine Memory Processes and Advanced Packaging

Competition in HBM4 and HBM4E spans DRAM dies, logic base dies, and stacked packaging. SK hynix, Samsung, and Micron use different process combinations, creating distinct roles for foundries, bonding-equipment makers, packaging-material suppliers, test provide…

ABF Package SubstratesCoWoS Advanced PackagingDRAM chipsEDA and Semiconductor IPWafer FabricationHBM logic base diesHBM / PWF manufacturingIC DesignMemory and storageMemory wafer foundryMemory assembly and testGlobal Unichip (3443)TSMC (2330)ASE Technology Holding (3711)Unimicron (3037)Nan Ya PCB (8046)Kinsus (3189)