English edition 2026-10-29 · Updated 2026-10-29
The Semiconductor Cycle Through ASML, TSMC, and Micron Earnings: Where Is Demand Strong, and Which Recoveries Remain Unconfirmed?
ASML’s equipment demand, TSMC’s advanced-node revenue, and Micron’s HBM supply agreements point to continued growth in the core AI supply chain.
Thin-Film DepositionEtching and CleaningWafer FabricationLithographyASMLTSMC (2330)Micron (MU)UMC (2303)GlobalFoundries (GFS)
English edition 2026-10-29 · Updated 2026-10-29
TPCA Show 2026: Physical Limits, Supply-Chain Beneficiaries, and Competition in Taiwan’s NT$1 Trillion PCB Industry
Taiwan’s PCB production value is projected to exceed NT$1.13 trillion in 2026. Drawing on the technologies and executive warnings presented at TPCA Show 2026, this article examines which supply-chain segments stand to benefit from physical material bottlenecks…
ABF Build-up FilmABF Package SubstratesCopper-Clad LaminateFlex and Rigid-Flex PCBsElectronic Glass ClothHigh-Density Interconnect PCBsHigh-Layer-Count PCBsMultilayer Rigid PCBsPrinted Circuit BoardsPCB Drills and RoutersCCL Resin SystemsIC Package Substrates
English edition 2026-10-29 · Updated 2026-10-29
NVIDIA Vera Rubin’s “Cable-Free” Design: Three Interconnect Layers and a Changing Supply Chain
Claims that “Vera Rubin computers do not use optical cables” conflate cable-free modular compute trays with the rack’s NVLink 6 copper backplane.
Active optical cables (AOC)Copper-Clad LaminateCo-Packaged OpticsGPUs and AI AcceleratorsPassive fiber cables and patch cordsPrinted Circuit BoardsAI Servers
English edition 2026-10-29 · Updated 2026-10-29
Low-CTE Glass-Cloth Shortages Persist: Potential Beneficiaries and the Prospects for Quartz Cloth
AI chips are driving larger, higher-layer-count package substrates, while low-CTE glass-cloth supply struggles to keep pace. Beyond Nittobo, Taiwan Glass, Baotek, and Honghe have formally disclosed customer-qualification progress, while Fulltech, Asahi Kasei,…
Electronic Glass ClothNittoboTaiwan Glass (1802)Baotek Industrial (5340)Honghe Technology (603256.SH)Fulltech Fiber Glass (1815)Asahi KaseiNan Ya Plastics (1303)
English edition 2026-10-29 · Updated 2026-10-29
What Is DSX POD? NVIDIA’s Modular AI Factories, 14-Day Deployment, and the Supply Chain
NVIDIA DSX POD integrates Vera Rubin compute systems with networking, power, and liquid cooling into modular units tested before shipment. It aims to cut deployment at a prepared site from about six months to as little as 14 days.
Data Center PowerServer rack system integrationRack frames and mounting structuresRack high-speed connectors and cablesRack power shelvesHon Hai / Foxconn (2317)Quanta Computer (2382)Wistron (3231)Pegatron (4938)GIGABYTE (2376)Delta Electronics (2308)
English edition 2026-10-29 · Updated 2026-10-29
Anthropic Turns an Operating Profit in Q2: Can High Gross Margins Fund Continued AI Research?
Anthropic’s public IPO filing shows approximately $974 million in operating profit in the second quarter of 2026 after recognized research, staffing, sales, and other operating costs. This provides positive evidence of AI-model profitability.
Language Models and APIs
English edition 2026-10-29 · Updated 2026-10-29
How Does Sony’s XYN Glasses-Free 3D Display Work? Microlenses, Eye Tracking, and New Supply-Chain Roles
Sony’s 6-inch ELF-MN1 brings glasses-free 3D characters to a desktop display through eye tracking, real-time rendering of two viewpoints, and fixed microlenses.
Glasses-free 3D display modulesEye-position tracking modulesInfrared and sensing componentsLenticular and light-routing filmsMicro-optical imprint tools and stampsMicro-optical forming and alignmentOptical film substrates3D image weaving and processingSwitchable 3D optical layersUV optical replication resinsBenQ Materials (8215)Himax Technologies (NASDAQ: HIMX)AUO (2409)Leia (United States)Morphotonics (Netherlands)ams OSRAM
English edition 2026-10-17 · Updated 2026-10-17
What Is NPO? Architecture Differences from CPO, Adoption Examples, and Taiwan’s Supply Chain
Near-packaged optics moves optical engines beside compute or switch-chip packages, shortening electrical paths while preserving flexibility in assembly and cooling.
CPO integration & packagingCPO platforms & systemsOptical EnginesFiber and Optical ConnectionsFiber coupling & alignmentLaser Light SourcesOptical drivers & receiversOptical communications & interconnectsOptical module DSPsOptical receiver supply chainOptical receiver integrationReceiver TIAs & analog front endsSilicon PhotonicsLintes Technology (6715)FIT Hon Teng (6088.HK)RViCentera Photonics (7917)Elite Advanced Laser (3450)LOTES (3533)ShunSin Technology (6451)Accton Technology (2345)Alpha Networks (3380)
English edition 2026-10-17 · Updated 2026-10-17
Is 200% CAGR for CPO and NPO Plausible? Optical-Module Growth and Market Share Explained
Annual compound growth above 200% for CPO and NPO may initially sound overly optimistic. Yet a small 2025 base, AI-driven optical-module demand, and rising adoption of new architectures provide an industry rationale.
Co-Packaged OpticsCPO integration & packagingCPO platforms & systemsExternal laser sourcesOptical EnginesFiber and Optical ConnectionsFiber coupling & alignmentSilicon-photonics PICs with Ge PDsInP-based detector epitaxyInGaAs photodetector dies & arraysInP optoelectronic substratesLaser Light SourcesLinear pluggable opticsPluggable Optical TransceiversOptical drivers & receiversOptical communications & interconnectsOptical module DSPsOptical manufacturing servicesOptical receiver supply chainOptical receiver measurement & testHeterogeneous III-V detector integrationPhotonics SOI wafersOptical receiver integrationReceiver TIAs & analog front endsSilicon Photonics
English edition 2026-10-17 · Updated 2026-10-17
Why AI Agents Drive CPU Demand: Workloads, Foundries, and the Named Supply Chain
As AI moves from answering questions to gathering information, operating software, running code, and repeatedly verifying results, data-center workloads are changing.
CMP PlanarizationThin-Film DepositionIon Implantation and Thermal ProcessingEDA and Semiconductor IPEtching and CleaningWafer FabricationIC DesignLithographyMetrology and Defect InspectionWafer and Packaged-Device TestingTSMC (2330)
English edition 2026-10-17 · Updated 2026-10-17
What NVIDIA’s PTFE Switch-Board Display Reveals About Supply-Chain Change
NVIDIA’s NVLink PTFE Board display has drawn attention to next-generation high-speed interconnect initiatives at Taiflex, Flexium, Shengyi, and other suppliers.
Copper-Clad LaminateHigh-Density Interconnect PCBsHigh-Layer-Count PCBsPrinted Circuit BoardsTaiflex (8039)Flexium (6269)Elite Material (2383)
English edition 2026-10-17 · Updated 2026-10-17
CoreWeave’s Stock and Bond Rout: Why Investors Are on Edge
As AI infrastructure moves from buying chips and signing long-term contracts to scrutiny of cash flow and debt-service capacity, capital markets are changing how they value the sector.
AI Data CentersAI ServersCoreWeaveNVIDIA
English edition 2026-10-17 · Updated 2026-10-17
Slower Smartphone Demand, More Expensive Components: Prices, Inventory, and Brand Exposure Across the Supply Chain
The 2026 smartphone market faces rising memory prices, a shrinking supply of low-cost handsets, and pressure on consumers’ purchasing power. The impact varies across the supply chain: some suppliers can raise prices, while others face fewer orders.
Image Sensors and CamerasSmartphonesAmbient-light and proximity ICsPhone charging and power-path ICsSmartphone display-driver ICsSmartphone EMS and manufacturingSmartphone fingerprint ICsPhone battery fuel-gauge ICsSmartphone ODM and designOPPO smartphonesSmartphone battery packsPhone battery protection ICsSamsung smartphonesTouch and display integrationSmartphone touch-controller ICsTranssion phone brandsvivo smartphonesXiaomi smartphonesSensortek (6732)FocalTech (3545)Sitronix (8016)Longcheer (603341)Huaqin (603296)Goodix (603160)Samsung Electronics (005930)SK hynix (000660)Micron (MU)Qualcomm (QCOM)Xiaomi (01810)
English edition 2026-10-17 · Updated 2026-10-17
What Is an Active Optical Cable? From 1.6T AOC to ALC and LPO: Low-Power Interconnects and Taiwanese Suppliers
AI data centers need faster, more energy-efficient connections as well as faster chips. Active optical cables integrate fiber and optoelectronic conversion at both ends, serving different needs from passive fiber and high-speed copper cables.
Optical module DSPsRack high-speed connectors and cablesAmphenolGIGALIGHTCredoNewPhotonicsCentera Photonics (7917)ezconn (6442)Foxlink (2392)FIT Hon Teng (6088.HK)Lintes Technology (6715)BizLink (3665)APAC Opto Electronics (4908)Walsin Lihwa (1605)
English edition 2026-10-17 · Updated 2026-10-17
Vera Rubin Supply Chain Update After OCP 2026
Vera Rubin is driving demand for high-voltage DC power distribution, liquid cooling, and advanced passive components, but specification upgrades, supplier qualification, and revenue growth follow different timelines.
Cooling supply chain800 V DC power distributionPower-supply and power-electronics chainPSU capacitorsAI ServersServer PSU modulesDelta Electronics (2308)LITEON (2301)Asia Vital Components (3017)Auras Technology (3324)Jentech Precision Industrial (3653)YAGEO (2327)Walsin Technology (2492)NVIDIA
English edition 2026-10-10 · Updated 2026-10-10
Innolux Enters RDL and Advanced Packaging: Large-Area Manufacturing Advantages, Production Hurdles, and Competitive Implications
As AI chips integrate more compute dies and memory into a single package, the industry’s challenge is expanding from making transistors smaller to connecting more chips while controlling packaging costs.
Thin-Film DepositionEtching and CleaningGlass-Core Package SubstratesGlass-Substrate Lithography EquipmentGlass-Based Package IntegrationGlass Build-Up Layers and RDL WiringLithographyInnolux (3481)TSMC (2330)ASE Technology Holding (3711)Powertech Technology (6239)
English edition 2026-10-10 · Updated 2026-10-10
OpenAI’s Annualized Revenue Falls Short of Earlier Reports: What $50 Billion Versus $70 Billion Says About AI Bubble Risk
The Financial Times reported that OpenAI’s annualized revenue approached $50 billion at the end of September, below the roughly $70 billion previously circulating and prompting concerns about AI growth.
AI Development and Agent PlatformsAI Evaluation, Monitoring and GovernanceLanguage Models and APIsOpenAIAnthropic
English edition 2026-10-10 · Updated 2026-10-10
Largan Moves From FA to FAU: How Will Cooperation and Competition in the Optical Supply Chain Change?
At its October 8 investor conference, Largan disclosed plans to expand from fiber arrays (FA) into fiber array unit (FAU) integration and pursue carrier assembly.
Co-Packaged OpticsFiber coupling & alignmentLargan Precision (3008)Ability Opto-Electronics Technology (3362)Genius Electronic Optical (3406)FOCI (3363)Himax Technologies (HIMX)Asia Optical (3019)Young Optics (3504)
English edition 2026-10-10 · Updated 2026-10-10
Battery Advances in 2026: From Silicon–Carbon Anodes and Ultrafast Charging to the Manufacturing Hurdles for Solid-State Batteries
Battery advances in 2026 span silicon–carbon anodes for phones, ultrafast EV charging, and the industrialization of semi-solid-state and all-solid-state designs.
Batteries and chargingDrone Energy and Power ManagementBattery Management Systems and Monitoring ICsBattery Packs and Structural IntegrationPhone battery fuel-gauge ICsSmartphone battery packsPhone battery protection ICs
English edition 2026-10-10 · Updated 2026-10-10
From SiC and GaN to AI Server Power Supplies: Mapping the Supply Chain and Taiwan’s Supplier Roles
SiC and GaN are changing the efficiency and size of power conversion, but a competitive server power supply also depends on magnetics, capacitors, packaging, thermal management, and control design.
Board DC/DC and core regulationGaN power devices800 V DC power distributionPower-semiconductor epitaxyPower-device wafer fabricationPower-device packaging and testPower-supply and power-electronics chainPSU assembly and insulation materialsPSU capacitorsPower control, driver and sensing ICsPSU magnetic componentsPower PCBs and copper-clad materialsInput filtering and power protectionComplete PSU testing and validationServer PSU modulesSiC power devicesSiC substrates for power devicesSilicon power devicesGlobalWafers (6488)Episil-Precision (3016)Episil Technologies (3707)Sinopower Semiconductor (6435)ASE Technology Holding (3711)APAQ Technology (6449)Taiwan Chinsan (8042)TAI-TECH (3357)BizLink (3665)Delta Electronics (2308)LITEON Technology (2301)AcBel Polytech (6282)
English edition 2026-10-10 · Updated 2026-10-10
Why AI Is Driving More Testing: From HBM Probe Cards to CPO Optoelectronic Test
As AI chips move toward higher power, multiple dies, and advanced packaging, testing demand is being driven by shipment volumes, test complexity, and the cost of failure.
Metrology and Defect InspectionOptical receiver measurement & testMPI (6223)WinWay Technology (6515)Chunghwa Precision Test Tech. (6510)Enlitech (7728)Chroma ATE (2360)FormFactorTeradyneAdvantestTokyo ElectronQuantifi Photonics
English edition 2026-10-10 · Updated 2026-10-10
How CPO Is Changing Next-Generation PDs and TIAs: From Faster Optical Lanes to Optoelectronic Integration
CPO moves optical/electrical conversion next to switch or compute chips, accelerating receiver co-design and package integration. Next-generation PDs and TIAs face simultaneous challenges in per-lane speed, power density, and production yield.
Co-Packaged OpticsSilicon-photonics PICs with Ge PDsInGaAs photodetector dies & arraysInP optoelectronic substratesPluggable Optical TransceiversOptical drivers & receiversOptical module DSPsOptical receiver measurement & testHeterogeneous III-V detector integrationPhotonics SOI wafersOptical receiver integrationReceiver TIAs & analog front endsGlobal Communication Semiconductors (GCS, 4991)Visual Photonics Epitaxy (2455)Albis OptoelectronicsMACOMMarvellSemtechBroadcomSTMicroelectronicsTower SemiconductorOpenLightGlobalFoundriesPOET TechnologiesNVIDIAIQEKopin
English edition 2026-10-06 · Updated 2026-10-06
SMRs and Microreactors: Benefits, Limitations, and the Case for Large Nuclear Plants in Taiwan
SMRs and micro modular reactors aim to reduce the upfront investment required for a nuclear project through smaller units, modular construction, and factory manufacturing, enabling phased deployment.
HALEU feedstockMMR microreactorsMMR demonstrations and microgridsMicroreactor integrationMicroreactor heat removalMajor Reactor ComponentsNuclear Instrumentation and ControlNuclear Decommissioning and RemediationReactor Technology and DesignRadioactive Waste DisposalNuclear Engineering and ConstructionNuclear Materials and Large ForgingsNuclear graphite and core materialsNuclear Power Supply ChainNuclear Maintenance and Life-Extension ServicesNuclear Plant OperationsFuel Reprocessing and RecyclingTurbines and Power Generation EquipmentNuclear Fuel Assembly ManufacturingSMR nuclear powerSMR grid and industrial projectsSMR site engineeringHigh-temperature gas SMRsLight-water SMR fuelLight-water SMR designsSMR equipment and modulesSpent-Fuel Storage and TransportTRISO fuel fabricationUranium Refining and ConversionUranium Enrichment ServicesUranium Mining and Concentrates
English edition 2026-10-06 · Updated 2026-10-06
From Nearly Two Hours to Five Minutes: AI Server Rack Integration and Taiwan's Supply Chain
An AI server rack must integrate computing, power, cooling, high-speed interconnects, and maintenance into a reliable system. NVIDIA says assembly of a single Vera Rubin compute tray can fall from nearly two hours to five minutes through redesigned modular str…
Rack design and system integrationRack backup and transient energy storageBusbars and power interconnectsServer rack system integrationCompute trays and server modulesDelivery, installation and site acceptanceRack frames and mounting structuresRack high-speed connectors and cablesBMCs and equipment managementPlatform architecture and rack specificationsRack power shelvesServer slide rails and mounting kitsIn-rack accelerator switch modulesServer chassis and module traysFactory rack testing and validationKing Slide (2059)REPON (6584)Cheng Fwa (5426)Chenbro (8210)Fositek (6805)Delta Electronics (2308)LITEON (2301)BizLink (3665)AVC (3017)Auras (3324)SUNON (2421)Kenmec (6125)ASPEED (5274)Quanta (2382)Foxconn (2317)Wistron (3231)Wiwynn (6669)ASUS (2357)GIGABYTE (2376)Inventec (2356)
English edition 2026-10-06 · Updated 2026-10-06
HBM4 and HBM4E Technology and Supply Chains: How the Three Major Suppliers Combine Memory Processes and Advanced Packaging
Competition in HBM4 and HBM4E spans DRAM dies, logic base dies, and stacked packaging. SK hynix, Samsung, and Micron use different process combinations, creating distinct roles for foundries, bonding-equipment makers, packaging-material suppliers, test provide…
ABF Package SubstratesCoWoS Advanced PackagingDRAM chipsEDA and Semiconductor IPWafer FabricationHBM logic base diesHBM / PWF manufacturingIC DesignMemory and storageMemory wafer foundryMemory assembly and testGlobal Unichip (3443)TSMC (2330)ASE Technology Holding (3711)Unimicron (3037)Nan Ya PCB (8046)Kinsus (3189)
English edition 2026-10-06 · Updated 2026-10-06
PCs May Cool First: Why HBM Demand Could Last Longer, and What It Means for Taiwan's Memory Industry
PCs and AI servers face different memory cycles. Higher end-product prices and brand inventories may slow PC purchasing first, while AI deployment, inference, and long-context applications could extend HBM demand growth.
Wafer FabricationHigh-Bandwidth MemoryMemory and storageTSMC (2330)PSMC (6770)ASE Technology Holding (3711)Powertech Technology (6239)CHPT (6510)Phison (8299)
English edition 2026-10-06 · Updated 2026-10-06
Why Glass Core Substrates Are Attracting NVIDIA's Attention: From Material Advantages to Manufacturing
Progress in AI chips is extending beyond scaling individual transistors toward packaging multiple dies and high-bandwidth memory together.
ABF Build-up FilmGlass Substrates for AI, HPC and InterconnectsGlass Metallization and Copper-Fill ChemistryGlass-Core Package SubstratesGlass, TGV and Stress MetrologyGlass InterposersGlass-Substrate Lamination EquipmentGlass-Substrate Lithography EquipmentMetallized TGVs and Conductive Glass CoresGlass-Based Package IntegrationGlass Build-Up Layers and RDL WiringGlass Substrate Supply ChainGlass Wet-Etching EquipmentGPUs and AI AcceleratorsHigh-Bandwidth MemoryTGV Laser Processing EquipmentTGV Glass-Core Processing Services
English edition 2026-10-06 · Updated 2026-10-06
Are Drones Entirely China's Market? Looking Beyond DJI Through the Supply Chain
DJI is often the first name people associate with drones, making opportunities for other countries seem limited. Yet aerial photography, industrial inspection, and military reconnaissance have different technical and procurement requirements.
Airframes and Structural MaterialsConsumer DronesDrone Supply ChainDrone and System IntegrationDrone Energy and Power ManagementCommunications and Data LinksMission PayloadsDrone PropulsionDrone Software and Operations ServicesFlight Control Hardware and SoftwareGround Control StationsIndustrial and Commercial DronesMilitary DronesNavigation and Inertial Sensing
English edition 2026-10-06 · Updated 2026-10-06
FOWLP vs. FOPLP: Fan-Out Packaging Advantages, Production Bottlenecks, and Costs
FOWLP and FOPLP are both forms of fan-out packaging. Their main difference is whether processing uses a circular wafer or a rectangular panel.
Semiconductor PackagingCMP PlanarizationThin-Film DepositionIon Implantation and Thermal ProcessingEtching and CleaningWafer FabricationLithographyMetrology and Defect InspectionPhotomasksProcess Chemicals and GasesSemiconductor Silicon WafersTSMC (2330)Innolux (3481)ASE Technology Holding (3711)
English edition 2026-10-06 · Updated 2026-10-06
How Could Amazon's Satellite Deployment Delays Reshape Competition with SpaceX?
What do launch-vehicle accidents and Amazon's deployment delays mean for service availability, customer choices, and supply-chain orders?
Copper-Clad LaminateCopper Foil for PCBsGround Stations and GatewaysSatellite Launch and DeploymentLEO Satellite CommunicationsSatellite Communications PayloadsCommunication SatellitesPCBs for Satellite CommunicationsSatellite User Terminals
English edition 2026-10-06 · Updated 2026-10-06
What Are M9 Materials? Understanding the Circuit-Board Materials Upgrade Behind AI Servers
Copper-clad laminate development is accelerating. Here is what the intensely competitive M9 materials generation is about.
Copper-Clad LaminateCopper Foil for PCBsElectronic Glass ClothCCL Resin Systems
English edition 2026-10-06 · Updated 2026-10-06
SAP and mSAP for PCBs: How Fine Traces Are Made, and What Has Changed by 2026
Smartphone mainboards, optical communications modules, and IC package substrates must connect more signals within limited space. As traces shrink, the traditional method of starting with a full copper layer and etching away the excess struggles to maintain lin…
Copper-Clad LaminatePrinted Circuit Boards
English edition 2026-10-06 · Updated 2026-10-06
FA/FAU and Optical Coupling: Will Largan Become FOCI's Partner or Competitor?
CPO brings optical communications components next to compute or switch chips, bringing fiber alignment, cooling space, and production-yield challenges into the package.
Co-Packaged OpticsCPO integration & packagingCPO platforms & systemsOptical EnginesFiber and Optical ConnectionsLaser Light SourcesPluggable Optical TransceiversOptical communications & interconnectsSilicon PhotonicsFOCI (3363)Largan Precision (3008)Genius Electronic Optical (3406)Ability Opto-Electronics Technology (3362)Young Optics (3504)Asia Optical (3019)
English edition 2026-10-06 · Updated 2026-10-06
How CPO Addresses High-Speed Interconnect Bottlenecks: Seven Manufacturing Stages and the Challenges of Scaling Production
CPO moves optical engines next to the switch ASIC, shortening high-speed electrical paths and opening up new possibilities for bandwidth density and energy efficiency.
Co-Packaged OpticsCPO integration & packagingCPO platforms & systemsExternal laser sourcesOptical EnginesFiber coupling & alignmentLaser Light SourcesOptical drivers & receiversOptical manufacturing servicesSilicon PhotonicsTSMC (2330)NVIDIABroadcomIntelLumentumFabrinetBrowave (3163)SENKOASE Technology Holding (3711)Foxconn (2317)Corning
English edition 2026-10-06 · Updated 2026-10-06
Why M9/M10 and CPO Are Advancing Together: Material Demand in Next-Generation AI Servers
CPO shortens high-speed electrical connections between switch ASICs and optical engines, but that does not mean AI servers can dispense with low-loss PCBs.
Copper-Clad LaminateCo-Packaged OpticsPrinted Circuit BoardsAI ServersSilicon Photonics
English edition 2026-10-06 · Updated 2026-10-06
Where Is CPO Used Today, and What Does It Replace?
Co-packaged optics (CPO) moves optical engines next to the switch ASIC, shortening high-speed electrical paths and reducing power consumption.
Copper-Clad LaminateCo-Packaged OpticsPrinted Circuit Boards
