INDUSTRY ANALYSIS

GPUs and AI Accelerators analysis

Explore companies, technologies and supply chains. English translations are published in batches, with the original sources and dates preserved.

English edition 2026-10-29 · Updated 2026-10-29

NVIDIA Vera Rubin’s “Cable-Free” Design: Three Interconnect Layers and a Changing Supply Chain

Claims that “Vera Rubin computers do not use optical cables” conflate cable-free modular compute trays with the rack’s NVLink 6 copper backplane.

Active optical cables (AOC)Copper-Clad LaminateCo-Packaged OpticsGPUs and AI AcceleratorsPassive fiber cables and patch cordsPrinted Circuit BoardsAI Servers

English edition 2026-10-06 · Updated 2026-10-06

Why Glass Core Substrates Are Attracting NVIDIA's Attention: From Material Advantages to Manufacturing

Progress in AI chips is extending beyond scaling individual transistors toward packaging multiple dies and high-bandwidth memory together.

ABF Build-up FilmGlass Substrates for AI, HPC and InterconnectsGlass Metallization and Copper-Fill ChemistryGlass-Core Package SubstratesGlass, TGV and Stress MetrologyGlass InterposersGlass-Substrate Lamination EquipmentGlass-Substrate Lithography EquipmentMetallized TGVs and Conductive Glass CoresGlass-Based Package IntegrationGlass Build-Up Layers and RDL WiringGlass Substrate Supply ChainGlass Wet-Etching EquipmentGPUs and AI AcceleratorsHigh-Bandwidth MemoryTGV Laser Processing EquipmentTGV Glass-Core Processing Services