INDUSTRY ANALYSIS
Memory and storage analysis
Explore companies, technologies and supply chains. English translations are published in batches, with the original sources and dates preserved.
HBM4 and HBM4E Technology and Supply Chains: How the Three Major Suppliers Combine Memory Processes and Advanced Packaging
Competition in HBM4 and HBM4E spans DRAM dies, logic base dies, and stacked packaging. SK hynix, Samsung, and Micron use different process combinations, creating distinct roles for foundries, bonding-equipment makers, packaging-material suppliers, test provide…
PCs May Cool First: Why HBM Demand Could Last Longer, and What It Means for Taiwan's Memory Industry
PCs and AI servers face different memory cycles. Higher end-product prices and brand inventories may slow PC purchasing first, while AI deployment, inference, and long-context applications could extend HBM demand growth.