INDUSTRY ANALYSIS

EDA and Semiconductor IP analysis

Explore companies, technologies and supply chains. English translations are published in batches, with the original sources and dates preserved.

English edition 2026-10-17 · Updated 2026-10-17

Why AI Agents Drive CPU Demand: Workloads, Foundries, and the Named Supply Chain

As AI moves from answering questions to gathering information, operating software, running code, and repeatedly verifying results, data-center workloads are changing.

CMP PlanarizationThin-Film DepositionIon Implantation and Thermal ProcessingEDA and Semiconductor IPEtching and CleaningWafer FabricationIC DesignLithographyMetrology and Defect InspectionWafer and Packaged-Device TestingTSMC (2330)

English edition 2026-10-06 · Updated 2026-10-06

HBM4 and HBM4E Technology and Supply Chains: How the Three Major Suppliers Combine Memory Processes and Advanced Packaging

Competition in HBM4 and HBM4E spans DRAM dies, logic base dies, and stacked packaging. SK hynix, Samsung, and Micron use different process combinations, creating distinct roles for foundries, bonding-equipment makers, packaging-material suppliers, test provide…

ABF Package SubstratesCoWoS Advanced PackagingDRAM chipsEDA and Semiconductor IPWafer FabricationHBM logic base diesHBM / PWF manufacturingIC DesignMemory and storageMemory wafer foundryMemory assembly and testGlobal Unichip (3443)TSMC (2330)ASE Technology Holding (3711)Unimicron (3037)Nan Ya PCB (8046)Kinsus (3189)