INDUSTRY ANALYSIS
Glass Build-Up Layers and RDL Wiring analysis
Explore companies, technologies and supply chains. English translations are published in batches, with the original sources and dates preserved.
Innolux Enters RDL and Advanced Packaging: Large-Area Manufacturing Advantages, Production Hurdles, and Competitive Implications
As AI chips integrate more compute dies and memory into a single package, the industry’s challenge is expanding from making transistors smaller to connecting more chips while controlling packaging costs.
Why Glass Core Substrates Are Attracting NVIDIA's Attention: From Material Advantages to Manufacturing
Progress in AI chips is extending beyond scaling individual transistors toward packaging multiple dies and high-bandwidth memory together.