INDUSTRY ANALYSIS

High-Bandwidth Memory analysis

Explore companies, technologies and supply chains. English translations are published in batches, with the original sources and dates preserved.

English edition 2026-10-06 · Updated 2026-10-06

PCs May Cool First: Why HBM Demand Could Last Longer, and What It Means for Taiwan's Memory Industry

PCs and AI servers face different memory cycles. Higher end-product prices and brand inventories may slow PC purchasing first, while AI deployment, inference, and long-context applications could extend HBM demand growth.

Wafer FabricationHigh-Bandwidth MemoryMemory and storageTSMC (2330)PSMC (6770)ASE Technology Holding (3711)Powertech Technology (6239)CHPT (6510)Phison (8299)

English edition 2026-10-06 · Updated 2026-10-06

Why Glass Core Substrates Are Attracting NVIDIA's Attention: From Material Advantages to Manufacturing

Progress in AI chips is extending beyond scaling individual transistors toward packaging multiple dies and high-bandwidth memory together.

ABF Build-up FilmGlass Substrates for AI, HPC and InterconnectsGlass Metallization and Copper-Fill ChemistryGlass-Core Package SubstratesGlass, TGV and Stress MetrologyGlass InterposersGlass-Substrate Lamination EquipmentGlass-Substrate Lithography EquipmentMetallized TGVs and Conductive Glass CoresGlass-Based Package IntegrationGlass Build-Up Layers and RDL WiringGlass Substrate Supply ChainGlass Wet-Etching EquipmentGPUs and AI AcceleratorsHigh-Bandwidth MemoryTGV Laser Processing EquipmentTGV Glass-Core Processing Services