INDUSTRY ANALYSIS
Metrology and Defect Inspection analysis
Explore companies, technologies and supply chains. English translations are published in batches, with the original sources and dates preserved.
Why AI Agents Drive CPU Demand: Workloads, Foundries, and the Named Supply Chain
As AI moves from answering questions to gathering information, operating software, running code, and repeatedly verifying results, data-center workloads are changing.
Why AI Is Driving More Testing: From HBM Probe Cards to CPO Optoelectronic Test
As AI chips move toward higher power, multiple dies, and advanced packaging, testing demand is being driven by shipment volumes, test complexity, and the cost of failure.
FOWLP vs. FOPLP: Fan-Out Packaging Advantages, Production Bottlenecks, and Costs
FOWLP and FOPLP are both forms of fan-out packaging. Their main difference is whether processing uses a circular wafer or a rectangular panel.