Companies, organized by role

Notebook camera modules and webcams

External input devices or notebook keyboard modules, as categorized

External input devices or notebook keyboard modules, as categorized

Image-capture and camera modules.

External webcams

Keyboards and tablet keyboard accessories

Wired and wireless mice

Gaming, commercial and professional monitor manufacturing

LCD backlights, light guides and optical integration

Backlight modules and light guides for LCDs.

Touch and pen control

Notebook touchpad solutions

Touch controllers, fingerprint sensors and human-machine interface chips.

Mechanical key switches; not universal in notebooks

Mouse product capabilities

ODM integration of imaging, audio and edge AI platforms.

PMW3212/PMW3360 listed in Nordic reference designs

nRF Desktop keyboard, mouse and dongle reference designs

USB4/Thunderbolt docking stations

Deep-hole development disclosed; August 2026 guidance points to 2027 volume production for the related 400-layer NAND application.

Read the 2023 development results separately from updated 2026 production timing.

2026 half-year report: Nanova LUX-Cryo has stable production applications; cryogenic deep-hole XD-RIE entered customer evaluation. Product stages do not establish universal advanced-node volume capability.

2026 half-year report discloses high-end ICP qualification and production introduction plus stable CCP batch supply; specific leading nodes and end products remain incompletely disclosed.

RF, bias and matching solutions; no end-tool model identified.

MKS plasma products; distinguished here from the group Atotech wet-chemistry business.

Gas-delivery and pressure-measurement capabilities for etch.

Etch gas-flow and distribution control.

Products for etch endpoint and process monitoring.

Disclosed product application; Lam 2023 supplier awards separately support a historical relationship.

Vacuum and exhaust systems for semiconductor processing.

Disclosed etch-exhaust treatment, distinct from the pumping role.

Public ESC products; Lam supplier awards do not identify a particular etcher model.

Compatible-product role, not claimed as an OEM-qualified supplier to Lam, Applied or TEL.

Official etch chamber application; no Cryo 3.0 supply inferred.

Semiconductor rings, electrodes and related products.

Historical report discloses SiC components; no current tool model inferred.

Etch-component machining capabilities; no leading tool model or production node specified.

Process-resistant, insulating and other ceramic products.

Ceramic materials and components for semiconductor equipment.

Historical 2020 presentation includes etch applications, not evidence of a latest-tool BOM.

Key modules, components and system integration for front-end process equipment.

Gas and reaction-signal monitoring; Lam 2024 supplier awards do not identify the tool model.

High-purity electronic specialty-gas catalog.

enScribe etch materials and collaborative development.

Electronic specialty gases and materials.

KSG5 and other etch gases; assess each product disclosure.

CCL and prepreg for high-speed digital and high-frequency RF applications, upstream of circuit-board manufacturing.

Lists servers as an application for high-speed digital laminates; supplies board materials, not complete servers.

Lists enterprise routers and switches as laminate applications for high-speed signals; not a switch brand or assembler.

PegaClad 300 applications include antennas and LEO satellites; supplies substrates and prepregs, not complete tracking antennas.

PCB materials at different loss levels, from general FR-4 to high-speed, low-loss applications.

Copper-clad laminates and prepregs for PCBs.

Rigid, high-frequency and high-speed digital materials for different circuit-board requirements.

MEGTRON multilayer-board materials emphasize high-speed signals, low transmission loss and thermal reliability.

Public R&D covers low-CTE CCL cores for semiconductor package substrates, addressing warpage and reliability.

Public CPO solutions covering fiber, optical-IC connection assemblies and high-density connectors, with stated NVIDIA SiPh ecosystem collaboration.

Public CPO solutions covering fiber, optical-IC connection assemblies and high-density connectors, with stated NVIDIA SiPh ecosystem collaboration.

Attitude determination and control systems; not a complete-satellite manufacturer.

ASE Technology Holding provides packaging and testing through ASE, SPIL and other subsidiaries; listed here as a holding company.

ASE Technology Holding provides packaging and testing through ASE, SPIL and other subsidiaries; listed here as a holding company.