| AI Data Centers → AI Applications and Devices | Cloud AI infrastructure Data centers host training and inference, at a different level from on-device computing. | NVIDIA | AI data-center system architecture 2026-09-26 |
| AI Applications and Devices → AI PCs and Workstations | Personal-device product category AI PCs provide local AI computing; not all functions necessarily work offline. | Intel | CPU, GPU and NPU in AI PCs 2026-09-26 |
| Smartphones ↔ AI Applications and Devices | On-device AI applications Phones with compatible platforms and software can run local AI; capabilities are not identical across all phones. | Qualcomm | CPU, GPU, NPU and ISP in smartphone platforms 2026-09-26 |
| AI Applications and Devices → Edge AI Devices | Deployment near the data source Edge devices can run AI near data sources while also collaborating with the cloud. | NVIDIA | Jetson edge AI platform 2026-09-26 |
| Robots and Intelligent Equipment ↔ AI Applications and Devices | Perception and planning AI can support robot perception and planning; control and mechanical systems are still required. | NVIDIA | Robotics and cloud-to-edge development architecture 2026-09-26 |
| AI Servers → AI Data Centers | Computing systems AI servers are data-center computing components that work with networking, storage and facilities. | NVIDIA | AI data-center system architecture 2026-09-26 |
| Network Switches → AI Data Centers | Networking between systems Switching equipment supports different data-center networks with different connectivity purposes. | NVIDIA | Data-center networking and storage architecture 2026-09-26 |
| Cooling supply chain → AI Data Centers | Thermal infrastructure Air or liquid cooling must suit racks and facilities; the approaches can coexist. | Delta | Data-center air and liquid cooling 2026-09-26 |
| Data Center Power → AI Data Centers | Power conversion and distribution Power architecture spans facilities, racks and systems and must be designed with computing and thermal loads. | Delta | Data-center power and cooling systems 2026-09-26 |
| Data Center Power → AI Servers | System power Rack and system supplies power servers; conversion and distribution depend on design. | Delta | Data-center power and cooling systems 2026-09-26 |
| SoCs and On-Device Computing → AI PCs and Workstations | On-device computing engine PC platforms may include CPUs, GPUs and NPUs; this is a functional category, not use of the same phone chip. | Intel | CPU, GPU and NPU in AI PCs 2026-09-26 |
| Memory and storage → AI PCs and Workstations | Models and working data PC computing needs memory and storage; interfaces and packages vary by platform. | Intel | AI compute hardware and workloads 2026-09-26 |
| Printed Circuit Boards → AI PCs and Workstations | System boards PC boards connect platforms and peripherals; size, signals and power requirements determine their configuration. | AT&S | Substrate-like PCBs and end applications 2026-09-26 |
| SoCs and On-Device Computing → Edge AI Devices | Embedded computing platform Edge devices can use integrated CPU, GPU or AI-accelerator platforms with appropriate peripheral interfaces. | NVIDIA | Jetson edge AI platform 2026-09-26 |
| Memory and storage → Edge AI Devices | Local computing data Embedded computing needs memory and storage selected for the platform and workload. | NVIDIA | Jetson edge AI platform 2026-09-26 |
| Image Sensors and Cameras → Edge AI Devices | Vision-sensing input Vision-based edge devices use camera data; edge AI can also process other sensor sources. | Sony | Industrial global-shutter image sensors 2026-09-26 |
| Printed Circuit Boards → Edge AI Devices | Embedded board interconnects Edge products use carrier or system boards to connect compute and peripherals; these are not package substrates. | AT&S | Substrate-like PCBs and end applications 2026-09-26 |
| Edge AI Devices → Robots and Intelligent Equipment | Local computing subsystem Robots may carry edge modules for perception and decisions; one module need not provide all control functions. | NVIDIA | Robotics and cloud-to-edge development architecture 2026-09-26 |
| Image Sensors and Cameras → Robots and Intelligent Equipment | Vision-sensing option Cameras are one robot-sensor option; types and quantities depend on the task. | NVIDIA | Robotics and cloud-to-edge development architecture 2026-09-26 |
| AI Data Centers ↔ Edge AI Devices | Model development and deployment Cloud or other systems can develop models while edge devices run local tasks; connectivity needs vary. | NVIDIA | Robotics and cloud-to-edge development architecture 2026-09-26 |
| AI Data Centers → Cloud AI Compute | Equipment resources offered as services Cloud compute uses data-center computing, storage and networking resources; this link represents functional roles. | CoreWeave | AI cloud-computing platform 2026-09-29 |
| Edge AI Devices → Vision Models and Platforms | On-site deployment support Vision AI can run on edge devices or work with cloud services; recognition does not always require the cloud. | NVIDIA | Metropolis vision AI platform 2026-09-29 |
| Vision Inspection and Automation Integration ↔ Robots and Intelligent Equipment | Vision guidance and on-site coordination Industrial vision can guide robots; robots do not all use the same vision solution. | Cognex | In-Sight industrial vision systems 2026-09-29 |
| Edge AI Devices ↔ Mission Payloads | Onboard image processing Onboard computing can process imagery, integrated according to platform and mission needs. | ModalAI | VOXL 2 onboard computing platform 2026-09-29 |
| AI Data Centers → Cloud and Commerce Infrastructure | Cloud infrastructure Data centers support digital commerce; company relationships still require case-by-case verification. | AWS | Cloud services for digital commerce 2026-09-30 |
| Power grids and dispatch → Data Center Power | Electricity for data centers | EIA | Electricity transmission and delivery to consumers 2026-10-01 |
| Facility cooling and heat rejection → AI Data Centers | Facility cooling infrastructure Scope note 1 | Trane | Data center cooling equipment 2026-10-01 |
| Immersion cooling systems ↔ AI Data Centers | Optional data center cooling architecture | Submer | SmartPod EVO single-phase immersion 2026-10-01 |
| Heat sinks and fins ↔ AI PCs and Workstations | PC and workstation cooling designs | TaiSol | Industrial PC heat sinks 2026-10-01 |
| DRAM modules → AI PCs and Workstations | System working memory Scope note 2 | Transcend | Memory modules and storage products 2026-10-03 |
| DRAM chips → Edge AI Devices | On-board and embedded memory Scope note 2 | ESMT | Memory IC design and products 2026-10-03 |
| NOR and specialty flash → Edge AI Devices | Firmware and embedded storage Scope note 2 | Macronix | NOR, NAND and ROM products 2026-10-03 |
| SSDs and embedded storage → AI PCs and Workstations | SSDs and storage devices Scope note 2 | Transcend | Memory modules and storage products 2026-10-03 |
| AI memory extension and cache ↔ AI PCs and Workstations | Capacity-extension option for AI PCs Scope note 2 | Phison | aiDAPTIV cache memory: role and limitations 2026-10-03 |
| Data Center Power ↔ Delivery, installation and site acceptance | Prepare facility power Scope note 3 | Vertiv | Integrated rack infrastructure 2026-10-05 |
| Delivery, installation and site acceptance → AI Data Centers | Accepted systems enter data center service Scope note 3 | Supermicro | Rack integration, testing and delivery 2026-10-05 |
| Data Center Power → Power-supply and power-electronics chain | Power components and systems supply chain Scope note 4 | TI | 12 V and 48/54 V server PSU design 2026-10-08 |
| Data Center Power → 800 V DC power distribution | 800 V distribution architecture Scope note 4 | NVIDIA | 800 V DC architecture and deployment roadmap 2026-10-08 |
| AI PCs and Workstations ↔ Desktop personal computers | Some products are positioned as AI PCs Product function and industry roles; no company-to-company purchasing contract is asserted. | AMD | Processors and graphics 2026-10-30 |
| AI PCs and Workstations ↔ Notebook computers | Some products are positioned as AI PCs Product function and industry roles; no company-to-company purchasing contract is asserted. | AMD | Processors and graphics 2026-10-30 |