SUPPLY CHAIN HANDBOOK

Power electronics: Si, SiC, GaN, components and systems

Prepared by IndustryAtlas Editorial principles & corrections

Separate power-semiconductor substrates, epitaxy, design, fabrication and packaging, then trace magnetics, capacitors, PSUs, power shelves and board-level power. Component, PSU and rack-level power or efficiency figures are not directly comparable.

Most recent source review: 2026-10-30

Reading guide revised: 2026-10-30

Why does adopting SiC or GaN not by itself prove a better power supply?

Power devices handle selected switching and rectification functions. A supply also needs control, magnetics, capacitors, PCB design, protection and cooling. Semiconductor materials offer different voltage and switching options, but circuit architecture and operating loads determine the result. Wafer-to-device manufacturing and device-to-PSU integration are separate layers. Rack distribution and board regulators then continue converting power before it reaches processor operating voltages.

Substrates, epitaxy and device fabrication → Packaged power semiconductors
Materials and epitaxy establish controlled structures; fabrication creates devices. Packaging supplies electrical and thermal connections and testing. Silicon, SiC and GaN routes require separate process and application checks.
Power devices, passives and controls → Complete PSU modules
Switches combine with magnetics, capacitors, drivers, boards and cooling. Module validation checks load response, efficiency, temperature and protection beyond individual-device specifications.
PSUs or rack DC output → Board and processor power
Power shelves and distribution feed compute modules. Board DC/DC stages and core regulators reduce voltage for loads; higher upstream voltage still requires downstream conversion and appropriate interfaces.

What changes the choice?

Match input, output, load and cooling conditions when comparing efficiency or density. Silicon, SiC and GaN can serve different stages together; select for circuit requirements and cost rather than a material ranking.

Sources for this overview

Power supplies and power electronics

Power-supply and power-electronics chain

Semiconductors, components, PSUs and rack power

Si, SiC and GaN power devices combine with magnetics, capacitors, control ICs, PCBs and thermal parts to form PSUs serving servers and racks.

Entry sources reviewed: 2026-10-30

Products, materials and role

Explore semiconductor manufacturing, then the parallel component inputs to a PSU. Individual PSUs, power shelves, board regulators and BBUs have different roles; focused maps explain their materials and processes.

Power-device wafer fabrication PSU magnetic components PSU capacitors Server PSU modules 800 V DC power distribution

Distinction: GaN, SiC and Si are material routes that may coexist in one PSU. A material name alone does not establish system power, efficiency or production status.

Sources

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Si/SiC/GaN power semiconductors

SiC substrates for power devices

Crystal growth and wafer processing

High-purity SiC is grown into crystals, sliced and surface-processed into substrates for power devices, typically followed by SiC epitaxy.

Entry sources reviewed: 2026-10-08

Products, materials and role

Wolfspeed supplies conductive SiC substrates and epitaxy. Crystal defects and surface quality influence subsequent device manufacturing.

Distinction: A SiC substrate is not a finished MOSFET. Conductive power substrates and semi-insulating RF substrates have different specifications.

Company roles

Scope of these company examples

Wolfspeed · United States · Example role · SiC materials
Conductive SiC substrates and epitaxial products.
Product / role source
Sources reviewed: 2026-10-08

Sources

Wolfspeed | Conductive SiC substrates and epitaxy

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Power-semiconductor epitaxy

Si, SiC and GaN-on-Si

Controlled crystalline layers provide the electrical and thickness profiles needed for power devices. Si, SiC and GaN use distinct epitaxial processes.

Entry sources reviewed: 2026-10-08

Products, materials and role

Episil-Precision publishes Si, SiC and GaN epitaxy. Its GaN-on-Si route grows GaN/AlGaN structures on silicon substrates.

Distinction: A GaN power device need not use a bulk GaN wafer. Supplying epitaxy does not establish responsibility for all subsequent device processing.

Company roles

Scope of these company examples

EPi · Taiwan · Example role · Si/SiC/GaN epitaxy
Published epitaxial materials and GaN-on-Si structures.
Product / role source
Sources reviewed: 2026-10-08

Sources

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Power-device wafer fabrication

Device design, platforms and fabrication

Wafer processing forms gates, contacts and metal interconnects in power devices. Integrated manufacturers may fabricate internally; design companies may use foundries.

Entry sources reviewed: 2026-10-08

Products, materials and role

Episil publishes silicon power-device, SiC and GaN manufacturing services. Voltage, resistance, switching and reliability require coordinated device and process design.

Distinction: Foundries, device brands and PSU manufacturers have distinct roles. Process capability does not establish a particular PSU customer order.

Company roles

Scope of these company examples

Episil Technologies (3707) · Taiwan · Example role · Power-device fabrication
Published silicon power-device, SiC and GaN manufacturing services.
Product / role source
Sources reviewed: 2026-10-08

Sources

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Silicon power devices

MOSFETs and diodes

Silicon MOSFETs and diodes perform switching, rectification and protection alongside SiC and GaN, depending on voltage, current and cost.

Entry sources reviewed: 2026-10-08

Products, materials and role

Different stages have different requirements. Conduction loss, reliability, packaging and price influence device choice. Silicon control ICs remain a separate functional category.

Distinction: GaN and SiC do not eliminate silicon from PSUs, and not every silicon IC is a power switch.

Company roles

Scope of these company examples

Infineon · Germany · Example role · Silicon power devices
Silicon devices in a mixed Si/SiC/GaN reference design.
Product / role source
Sources reviewed: 2026-10-08

Sources

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SiC power devices

MOSFETs and Schottky diodes

SiC devices serve conversion stages suited to their voltage and switching characteristics, including some server PFC and high-voltage architectures.

Entry sources reviewed: 2026-10-08

Products, materials and role

Infineon uses SiC in the PFC stage of its 12 kW reference design. Navitas publishes GaN and SiC development for 800 V architecture; separate devices, reference designs and deployments.

Distinction: Distribution voltage alone does not determine individual device ratings. Topology, margins and operating conditions affect selection.

Company roles

Scope of these company examples

Infineon · Germany · Example role · SiC power devices
SiC PFC in a 12 kW reference design, distinct from end-product shipments.
Product / role source
Sources reviewed: 2026-10-08
Navitas Semiconductor · United States · Example role · SiC power semiconductors
Published device development for 800 V architecture; verify status by product.
Product / role source
Sources reviewed: 2026-10-08

Sources

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GaN power devices

HEMTs, power ICs and fast switching

GaN power transistors support high-frequency switching in PFC, isolated conversion or downstream DC/DC stages, depending on the design.

Entry sources reviewed: 2026-10-30

Products, materials and role

TI demonstrates GaN PFC; Infineon uses GaN in isolated conversion in its 12 kW reference. Higher frequency can support smaller magnetics, with coordinated loss, layout and interference control.

Distinction: Power-conversion GaN and RF-amplifier GaN need product-specific classification; material names alone do not establish the application.

Company roles

Scope of these company examples

Infineon · Germany · Example role · GaN power transistors
GaN conversion stages in a 12 kW PSU reference.
Product / role source
Sources reviewed: 2026-10-08
Texas Instruments · United States · Example role · GaN and digital power
Published GaN PFC server PSU reference design.
Product / role source
Sources reviewed: 2026-10-08
Navitas Semiconductor · United States · Example role · GaN power devices
GaNFast power devices and development for 800 V architecture.
Product / role source
Sources reviewed: 2026-10-08

Sources

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Power-device packaging and test

Interconnects, heat flow and insulation

Packaging connects power dies to external circuits while providing thermal paths, insulation and mechanical protection, followed by electrical and quality testing.

Entry sources reviewed: 2026-10-08

Products, materials and role

Packages may use copper leadframes, wire or clip interconnects, die-attach materials and molding compounds. ASE offers SiC/GaN power packaging; materials vary by package.

Distinction: PSU power devices do not necessarily need CoWoS or ABF substrates. Device testing differs from complete PSU load validation.

Company roles

Scope of these company examples

ASE · Taiwan · Example role · Power-device packaging
aPPAK and other SiC/GaN packaging; no specific PSU customer is inferred.
Product / role source
Sources reviewed: 2026-10-08

Sources

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PSU components and materials

PSU magnetic components

Transformers, inductors and chokes

Transformers convert voltage and provide isolation; inductors store magnetic energy and smooth current; common-mode chokes suppress noise.

Entry sources reviewed: 2026-10-30

Products, materials and role

Materials include ferrite or metal-powder cores, copper windings and insulation. Planar transformers can use PCB windings. TDK publishes power transformers and MnZn ferrite materials.

Distinction: Faster GaN switching does not allow unlimited transformer shrinkage. Core and winding loss, temperature and insulation still constrain the design.

Company roles

Scope of these company examples

TDK · Japan · Example role · Transformers and magnetic materials
AC/DC transformers and power ferrites selected by specification.
Product / role source
Sources reviewed: 2026-10-08

Sources

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PSU capacitors

Electrolytic, polymer, film and MLCC

Capacitors share energy buffering, output filtering, resonance and high-frequency decoupling. Voltage, ripple current, life and size must suit the circuit stage.

Entry sources reviewed: 2026-10-30

Products, materials and role

Aluminum electrolytics use foil, an oxide dielectric and liquid or polymer electrolytes. Film capacitors may use metallized polypropylene; high-permittivity MLCCs use ceramic and metal electrode layers.

Distinction: PSU capacitors are not BBU batteries, and one capacitor technology cannot simply replace all others.

Company roles

Scope of these company examples

APAQ · Taiwan · Example role · Polymer and electrolytic capacitors
Published conductive-polymer, hybrid and aluminum electrolytic products.
Product / role source
Sources reviewed: 2026-10-08
Taiwan Chinsan (8042) · Taiwan · Example role · Aluminum electrolytic capacitors
AN series lists power-supply applications, not universal server qualification.
Product / role source
Sources reviewed: 2026-10-08
Murata Manufacturing · Japan · Example role · Ceramic capacitors
MLCC materials and device technology; qualify specifications by part.
Product / role source
Sources reviewed: 2026-10-08

Sources

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Power control, driver and sensing ICs

Regulation, switching, monitoring and PMBus

Controllers regulate conversion using voltage, current and temperature information; gate drivers operate power switches; digital management reports status.

Entry sources reviewed: 2026-10-30

Products, materials and role

TI server resources describe digital control and PMBus, and Infineon uses digital control in its 12 kW reference. Controllers, drivers and switches may be discrete or integrated.

Distinction: Control ICs differ from switches carrying the main power flow. Functional categories do not imply one physical chip per function.

Company roles

Scope of these company examples

Texas Instruments · United States · Example role · Control and power management
Server PSU design resources and digital control.
Product / role source
Sources reviewed: 2026-10-08
Infineon · Germany · Example role · Digital control and drivers
Control, driver and protection components in a 12 kW reference.
Product / role source
Sources reviewed: 2026-10-08

Sources

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Input filtering and power protection

EMI, surges, overcurrent and hot swap

Protection and filtering circuits address abnormal voltage, current, temperature and insertion conditions, coordinated with the PSU controller.

Entry sources reviewed: 2026-10-08

Products, materials and role

Typical parts include fuses, thermistors or varistors, sensing resistors, filter capacitors and chokes, and output isolation switches. Infineon publishes inrush, undervoltage and overvoltage protection functions.

Distinction: Individual protection components do not establish complete system safety qualification. Protection implementation depends on the architecture.

Sources

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Power PCBs and copper-clad materials

Current, insulation, heat and layout

Power PCBs carry components and connect high-current and control paths, coordinating copper thickness, insulation distances, temperature and switching layout.

Entry sources reviewed: 2026-10-08

Products, materials and role

Common laminates combine copper foil, glass fabric and resin. Isola 370HR is a published thermally robust epoxy FR-4 example, not an identified material in a particular PSU.

Distinction: An AI power board does not automatically require M9/M10 high-speed signal materials. Board requirements depend on their actual function.

Company roles

Scope of these company examples

Isola · United States · Example role · PCB laminate materials
370HR epoxy FR-4 is a material example, not a confirmed PSU bill of materials.
Product / role source
Sources reviewed: 2026-10-08

Sources

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PSU assembly and insulation materials

Joining, fixation, protection and thermal interfaces

Solder connects parts, adhesives secure large components, and insulation or optional potting protects assemblies. Thermal interfaces link components to heat-removal structures.

Entry sources reviewed: 2026-10-08

Products, materials and role

Epoxy, silicone or polyurethane systems may be selected by location. PCB resin, die encapsulation and assembly potting require different formulations; full potting is not universal in server PSUs.

Distinction: Thermal conductivity is only one selection factor alongside insulation, thickness, stress, processing and serviceability.

Company roles

Scope of these company examples

Electrolube · United Kingdom · Example role · Potting and protective materials
Published epoxy, silicone and other encapsulants; use depends on the product design.
Product / role source
Sources reviewed: 2026-10-08
Henkel · Germany · Example role · Thermal and insulating interfaces
Gap pads, fillers and thermal interfaces qualified for electrical and thermal conditions.
Product / role source
Sources reviewed: 2026-10-08

Sources

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PSUs, shelves and board power

Server PSU modules

AC/DC, DC/DC and power conversion

A PSU converts its specified input into server DC output, combining power devices, magnetics, capacitors, control, PCBs and thermal components.

Entry sources reviewed: 2026-10-08

Products, materials and role

A typical AC/DC path includes input protection/filtering, rectification/PFC, isolated DC/DC and output filtering/protection. Delta publishes a 5.5 kW PSU; Acbel lists six such modules in a 33 kW shelf.

Power-device packaging and test PSU magnetic components PSU capacitors Power control, driver and sensing ICs Input filtering and power protection Power PCBs and copper-clad materials PSU assembly and insulation materials Complete PSU testing and validation

Distinction: Module power, aggregate shelf rating and usable redundant capacity differ. Peak efficiency does not describe every operating load.

Company roles

Scope of these company examples

Delta Electronics · Taiwan · Example role · Server PSU modules
Published 5.5 kW redundant PSU with up to 97.5% efficiency under specified conditions.
Product / role source
Sources reviewed: 2026-10-08
Acbel · Taiwan · Example role · PSUs and power shelves
OCP listing describes six 5.5 kW PSUs forming a 33 kW shelf.
Product / role source
Sources reviewed: 2026-10-08

Sources

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Complete PSU testing and validation

Efficiency, transients, temperature and protection

An assembled PSU is checked against input/output, load-change, efficiency, temperature and protection requirements, with applicable safety and reliability qualification.

Entry sources reviewed: 2026-10-08

Products, materials and role

Compare efficiency at matched input voltage, load, temperature and fan-power boundaries. Infineon specifies peak and full-load conditions; Delta publishes certification for a particular product.

Distinction: Efficiency certification alone does not establish every safety, life or transient requirement, nor a production order from a specific customer.

Sources

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Board DC/DC and core regulation

Intermediate buses, VRMs and load points

Server-side converters reduce 48/54 V or 12 V toward processor voltages, using intermediate conversion and multiphase regulation close to CPUs and GPUs.

Entry sources reviewed: 2026-10-30

Products, materials and role

This level also uses switches, controllers, inductors and capacitors but has different voltage, current, location and thermal requirements. Infineon publishes the 48 V-to-core architecture.

Distinction: PSU output is not GPU core voltage, and motherboard VRM components are not automatically part of the external PSU bill of materials.

Company roles

Scope of these company examples

Infineon · Germany · Example role · 48 V-to-core power
Intermediate conversion and processor-side multiphase design resources.
Product / role source
Sources reviewed: 2026-10-08

Sources

Infineon | Power conversion from 48 V to the processor core

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800 V DC power distribution

Architecture, conversion and protection

Higher distribution voltage reduces current at the same power, changing conductor and conversion design options for dense computing. Voltage is still reduced near the load.

Entry sources reviewed: 2026-10-08

Products, materials and role

In August 2026 NVIDIA scheduled an MGX-compatible 800 V power rack for the second half of 2026 and a row power center for 2027. These roadmap statements do not describe adoption in every existing facility.

Distinction: 800 V is a distribution level, not GPU core voltage. Demonstrations, reference designs, availability plans and production deployments are distinct evidence.

Sources

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How the roles connect

Each connection appears once in this handbook. Classification describes a branch; technology links compare or relate approaches; service arrows point to the supported activity. Company examples do not establish a supply contract.

Connections, handoffs and sources
From / to	Handoff / relationship	Evidence
Semiconductor Silicon Wafers Power-semiconductor epitaxy	Substrate route for Si epitaxy and GaN-on-Si Scope note 1	Episil-Precision \| GaN-on-Si epitaxial structures 2026-10-08
SiC substrates for power devices Power-semiconductor epitaxy	Substrates for SiC epitaxy Scope note 1	Wolfspeed \| Conductive SiC substrates and epitaxy 2026-10-08
Power-semiconductor epitaxy Power-device wafer fabrication	Controlled crystalline layers for fabrication Scope note 1	Episil \| Power-device, SiC and GaN manufacturing services 2026-10-08
Power-device wafer fabrication Silicon power devices	Silicon power-device processing Scope note 1	Episil \| Power-device, SiC and GaN manufacturing services 2026-10-08
Power-device wafer fabrication SiC power devices	SiC power-device processing Scope note 1	Episil \| Power-device, SiC and GaN manufacturing services 2026-10-08
Power-device wafer fabrication GaN power devices	GaN power-device processing Scope note 1	Episil \| Power-device, SiC and GaN manufacturing services 2026-10-08
Silicon power devices Power-device packaging and test	Silicon power-die packaging Scope note 1	ASE \| Leadframe and power-device packaging 2026-10-08
SiC power devices Power-device packaging and test	SiC power-die packaging Scope note 1	ASE \| Leadframe and power-device packaging 2026-10-08
GaN power devices Power-device packaging and test	GaN power-die packaging Scope note 1	ASE \| Leadframe and power-device packaging 2026-10-08
Power-device packaging and test Server PSU modules	Packaged power devices Scope note 1	Infineon \| 12 kW PSU reference design combining Si, SiC and GaN 2026-10-08
PSU magnetic components Server PSU modules	Transformers, inductors and filter magnetics Scope note 1	TDK \| Transformers for AC/DC converters 2026-10-08
PSU capacitors Server PSU modules	Buffering, filtering and resonant components Scope note 1	TI \| 12 V and 48/54 V server PSU design 2026-10-08
Power control, driver and sensing ICs Server PSU modules	Control, drive and monitoring Scope note 1	TI \| 12 V and 48/54 V server PSU design 2026-10-08
Input filtering and power protection Server PSU modules	Input and output protection Scope note 1	Infineon \| 12 kW PSU specifications, control and protection 2026-10-08
Power PCBs and copper-clad materials Server PSU modules	Circuit mounting and interconnection Scope note 1	Isola \| Glass-reinforced epoxy FR-4 laminates 2026-10-08
PSU assembly and insulation materials Server PSU modules	Design-specific assembly and insulation materials Scope note 1	Electrolube \| Epoxy, silicone and polyurethane encapsulation resins 2026-10-08
Copper-Clad Laminate Power PCBs and copper-clad materials	Copper-clad insulating laminates Scope note 1	Isola \| Glass-reinforced epoxy FR-4 laminates 2026-10-08
CCL Resin Systems Power PCBs and copper-clad materials	Board-resin systems selected by specification Scope note 1	Isola \| Glass-reinforced epoxy FR-4 laminates 2026-10-08
Copper Foil for PCBs Power PCBs and copper-clad materials	Conductive copper layers Scope note 1	Isola \| Glass-reinforced epoxy FR-4 laminates 2026-10-08
Thermal interface materials Server PSU modules	Thermal interfaces selected for heat paths Scope note 1	Henkel \| Thermal interfaces and electrically insulating materials 2026-10-08
Heat sinks and fins Server PSU modules	Component heat-removal structures Scope note 1	Infineon \| 12 kW PSU specifications, control and protection 2026-10-08
Cooling fans and fan walls Server PSU modules	Forced convection for air-cooled designs Scope note 1	Infineon \| 12 kW PSU specifications, control and protection 2026-10-08
Server PSU modules Rack power shelves	Multiple modules integrated into a shelf Scope note 1	OCP \| Acbel 33 kW shelf and 5.5 kW PSU modules 2026-10-08
Server PSU modules AI Servers	PSUs integrated for individual-server architectures Scope note 1	TI \| 12 V and 48/54 V server PSU design 2026-10-08
Server PSU modules Board DC/DC and core regulation	Output for downstream voltage conversion Scope note 1	Infineon \| Power conversion from 48 V to the processor core 2026-10-08
Busbars and power interconnects Board DC/DC and core regulation	Distributed power for server-side conversion Scope note 1	Infineon \| Power conversion from 48 V to the processor core 2026-10-08
Board DC/DC and core regulation AI Servers	Local regulation for processors Scope note 1	Infineon \| Power conversion from 48 V to the processor core 2026-10-08
Complete PSU testing and validation Server PSU modules	Complete electrical, efficiency and protection validation Scope note 1	Infineon \| 12 kW PSU specifications, control and protection 2026-10-08
Semiconductor Packaging Power-device packaging and test	Power-device packaging branch Scope note 1	ASE \| Leadframe and power-device packaging 2026-10-08
Printed Circuit Boards Power PCBs and copper-clad materials	Power-board application branch Scope note 1	Isola \| Glass-reinforced epoxy FR-4 laminates 2026-10-08
Power-supply and power-electronics chain Server PSU modules	PSU modules Scope note 1	TI \| 12 V and 48/54 V server PSU design 2026-10-08
Power-supply and power-electronics chain Power-device wafer fabrication	Power-semiconductor manufacturing branch Scope note 1	Episil \| Power-device, SiC and GaN manufacturing services 2026-10-08
Power-supply and power-electronics chain PSU magnetic components	PSU component branch Scope note 1	TDK \| Transformers for AC/DC converters 2026-10-08
Power-supply and power-electronics chain 800 V DC power distribution	High-voltage DC architecture branch Scope note 1	NVIDIA \| 800 V DC architecture and deployment roadmap 2026-10-08
Data Center Power Power-supply and power-electronics chain	Power components and systems supply chain Scope note 1	TI \| 12 V and 48/54 V server PSU design 2026-10-08
Data Center Power 800 V DC power distribution	800 V distribution architecture Scope note 1	NVIDIA \| 800 V DC architecture and deployment roadmap 2026-10-08
800 V DC power distribution Rack power shelves	Platform-specific distribution and conversion 800 V needs compatible conversion, protection and interfaces; existing 50 V shelves are not assumed to accept 800 V directly.	NVIDIA \| 800 V DC architecture and deployment roadmap 2026-10-08
800 V DC power distribution Board DC/DC and core regulation	Voltage still reduces near the load Scope note 1	Infineon \| Power conversion from 48 V to the processor core 2026-10-08
Rack backup and transient energy storage Server PSU modules	Architecture-specific backup and transient management Scope note 1	NVIDIA \| 800 V DC architecture and deployment roadmap 2026-10-08
Automotive Power and Control Semiconductors SiC power devices	Shared device technology with separate qualification Scope note 1	Episil \| Power-device, SiC and GaN manufacturing services 2026-10-08
PSU assembly and insulation materials Power-device packaging and test	Package and assembly materials differ by location Scope note 1	ASE \| Interconnects and thermal design in power packaging 2026-10-08
Board DC/DC and core regulation Motherboards and logic boards	Board-level integration Product function and industry roles; no company-to-company purchasing contract is asserted.	ASUS \| Motherboard specifications 2026-10-30
GaN power devices Laptop adapters and chargers	Selection depends on power design Product function and industry roles; no company-to-company purchasing contract is asserted.	Chicony Power \| GaN laptop adapters 2026-10-30
PSU magnetic components Laptop adapters and chargers	Selection depends on power design Product function and industry roles; no company-to-company purchasing contract is asserted.	Chicony Power \| GaN laptop adapters 2026-10-30
PSU capacitors Laptop adapters and chargers	Selection depends on power design Product function and industry roles; no company-to-company purchasing contract is asserted.	Chicony Power \| GaN laptop adapters 2026-10-30
Power control, driver and sensing ICs Laptop adapters and chargers	Selection depends on power design Product function and industry roles; no company-to-company purchasing contract is asserted.	Chicony Power \| GaN laptop adapters 2026-10-30
Power-supply and power-electronics chain Desktop PC power supplies	PC power application branch Product function and industry roles; no company-to-company purchasing contract is asserted.	ASUS \| PC power supplies 2026-10-30

Connection scope notes

Material, component or system roles; not proof of supply contracts between all representative companies.

Scope of company examples

Examples from published products and services, not rankings or a complete server supplier list. Role links do not establish company-to-company orders.

Why does adopting SiC or GaN not by itself prove a better power supply?

Substrates, epitaxy and device fabrication → Packaged power semiconductors

Power devices, passives and controls → Complete PSU modules

PSUs or rack DC output → Board and processor power

What changes the choice?

Explore the technologies and changes

From SiC and GaN to AI Server Power Supplies: Mapping the Supply Chain and Taiwan’s Supplier Roles

Vera Rubin Supply Chain Update After OCP 2026

Power supplies and power electronics

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Si/SiC/GaN power semiconductors

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PSU components and materials

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PSUs, shelves and board power

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Long-form guides (Chinese)

AI 伺服器供應鏈：GPU、HBM、板材、散熱與網路的分工