ENGLISH OVERVIEW
Smartphones
Computing, radio, imaging and power in a compact product
A smartphone combines computing, communications, imaging, display and power in limited space. Its SoC, memory, RF, cameras, panel and battery connect upstream to HDI, flexible boards, packaging and CCL. This route describes major functions rather than a complete bill of materials.
Start with the function
The SoC provides computation and integrated functions; RF enables wireless connections; memory supports operation; displays and cameras provide interfaces.
- DRAM is working memory, while NAND stores systems, photos and models. Battery and power-management circuits supply the loads.
Connect the product to board materials
Phone motherboards emphasize dense interconnects, with flex or other connections between modules. HDI, substrate-like PCB and IC package substrates are different product levels.
- Materials must balance fine circuits, dimensions, processing and reliability. Not every phone board needs the lowest-loss high-speed laminate.
Follow batteries further upstream
Open the smartphone battery chain from batteries and charging to distinguish cells, packs and ICs and explore upstream materials and processes shared with EV batteries.
Design, manufacturing, interface ICs and brand cooperation
The map separates ODM/design, EMS/manufacturing, DDIC, touch, TDDI, ambient-light/proximity and fingerprint sensing. Brand connections carry individual public evidence for tracking demand changes; product roles alone do not establish financial risk.
Companies by industry role
Connected industry roles
Links describe supply, classification, technology or services. They do not establish transactions between individual companies.
SoCs and On-Device Computing → Smartphones
Main computing platform
Phone platforms integrate general computing, graphics and other functions; the integration scope depends on chip and device design.
Qualcomm | CPU, GPU, NPU and ISP in smartphone platformsMemory and storage → Smartphones
Working memory and storage
Phones use DRAM, NAND and other products with different functions; their capacities are not interchangeable.
Micron | Mobile memory and storageMobile Communications and RF → Smartphones
Mobile-network transceiving
Modems, RF front ends and antennas support mobile communications; configuration varies by platform and frequency band.
Qorvo | Smartphone RF front-end modulesImage Sensors and Cameras → Smartphones
Image input
Phone cameras combine sensors, optics, electronics and processing; pixel counts alone do not establish imaging capability.
Sony | Mobile image sensorsDisplay Panels and Modules → Smartphones
Display and user interface
Panels and modules form the phone interface; OLED is one technology option.
Samsung Display | Mobile OLEDBatteries and charging → Smartphones
Power and charging
Batteries and power management coordinate charging and loads; runtime depends on device consumption and use.
TI | Smartphone battery charging and system power-path exampleHigh-Density Interconnect PCBs → Smartphones
High-density mainboards
Space and interconnect requirements drive dense phone PCBs; board layers and processes vary.
AT&S | HDI and smartphone mainboardsFlex and Rigid-Flex PCBs → Smartphones
Internal flexible connections
Flex circuits suit space- and form-constrained electronics; module connections depend on device design.
TTM | Flex and rigid-flex PCBsSmartphones ↔ AI Applications and Devices
On-device AI applications
Phones with compatible platforms and software can run local AI; capabilities are not identical across all phones.
Qualcomm | CPU, GPU, NPU and ISP in smartphone platformsSmartphones ↔ Materials and Product Manufacturing
Electronic-merchandise entry point
The merchandise-supply view can extend into the site's smartphone manufacturing chain; no particular channel supply is inferred.
Amazon | Seller Central and Vendor Central trading rolesHeat pipes and vapor chambers → Smartphones
Thin mobile-device cooling
TaiSol | Mobile device coolingDRAM chips → Smartphones
Platform-specific mobile DRAM
a role relationship, not a contract among all listed companies.
Samsung | DDR, LPDDR, GDDR and HBMSSDs and embedded storage → Smartphones
Compatible UFS / eMMC
a role relationship, not a contract among all listed companies.
Phison | NAND controllers and storage solutionsSmartphones ↔ Mobile card interfaces
Mobile payment interface
Phone hardware and software support mobile payments.
Apple | Apple Pay security and privacyPhone battery fuel-gauge ICs → Smartphones
Remaining-charge estimates
Material, process or functional roles; no supply contract is inferred between every representative company.
TI | Fuel gauging and protection for mobile-phone packsPhone charging and power-path ICs → Smartphones
Charging and system-power control
Material, process or functional roles; no supply contract is inferred between every representative company.
TI | BQ25898 charging and power-path managementSmartphone battery packs → Smartphones
Battery-pack device integration
Material, process or functional roles; no supply contract is inferred between every representative company.
Simplo | IT business and smartphone battery modulesSmartphone ODM and design → Smartphones
Design and production integration
Companies are examples from published products. Role links do not imply contracts between every company; assess each brand relationship by its evidence and date.
Huaqin | Smartphone and tablet ODMSmartphone EMS and manufacturing → Smartphones
Device manufacturing services
Companies are examples from published products. Role links do not imply contracts between every company; assess each brand relationship by its evidence and date.
Pegatron | 2025 Q4 business review: communicationsSmartphone touch-controller ICs → Smartphones
Touch-input processing
Companies are examples from published products. Role links do not imply contracts between every company; assess each brand relationship by its evidence and date.
Goodix | Touch screen controllersAmbient-light and proximity ICs → Smartphones
Ambient-light and proximity sensing
Companies are examples from published products. Role links do not imply contracts between every company; assess each brand relationship by its evidence and date.
Sensortek | Ambient-light, proximity and color sensorsSmartphone fingerprint ICs → Smartphones
Fingerprint input
Companies are examples from published products. Role links do not imply contracts between every company; assess each brand relationship by its evidence and date.
Goodix | Capacitive, optical and ultrasonic fingerprint sensorsSmartphones → Samsung smartphones
Brand-side entry point
Companies are examples from published products. Role links do not imply contracts between every company; assess each brand relationship by its evidence and date.
Samsung | Galaxy smartphonesSmartphones → Xiaomi smartphones
Brand-side entry point
Companies are examples from published products. Role links do not imply contracts between every company; assess each brand relationship by its evidence and date.
Xiaomi | SmartphonesSmartphones → OPPO smartphones
Brand-side entry point
Companies are examples from published products. Role links do not imply contracts between every company; assess each brand relationship by its evidence and date.
OPPO | SmartphonesSmartphones → vivo smartphones
Brand-side entry point
Companies are examples from published products. Role links do not imply contracts between every company; assess each brand relationship by its evidence and date.
vivo | SmartphonesSmartphones → Transsion phone brands
Brand-side entry point
Companies are examples from published products. Role links do not imply contracts between every company; assess each brand relationship by its evidence and date.
Transsion | Company and TECNO, Infinix and itel brandsSmartphones → IT asset retirement and reuse
Retired mobile devices
Routing depends on device condition and data requirements, without naming a phone brand.
ERI | IT asset disposition and trackingCompany examples & product roles
Examples illustrate roles, not rankings or customer orders. Locations refer to headquarters, principal operations or the stated registration jurisdiction, not every production site.
ASUS ↗
Smartphone brand
Zenfone and ROG Phone integrate computing, imaging, display and communications.
Official product / role sourceApple ↗
Smartphone brand
iPhone integrates hardware, operating systems and mobile applications.
Official product / role sourceSamsung Electronics ↗
Smartphone brand
Galaxy smartphone families
Official product / role sourceXiaomi ↗
Smartphone brand
Xiaomi, REDMI and POCO
Official product / role sourceOPPO ↗
Smartphone brand
Phone brand and product integration
Official product / role sourcevivo ↗
Smartphone brand
Phone brand and product integration
Official product / role sourceTranssion Holdings ↗
Smartphone brand
TECNO, Infinix and itel
Official product / role sourceSources
- Qualcomm | Smartphone CPU, GPU, NPU and ISP platforms
- Micron | Mobile memory and storage
- AT&S | HDI and smartphone boards
- AT&S | Substrate-like PCBs
- Intel | AI PC CPUs, GPUs and NPUs
- LG Energy Solution | Small IT pouch cells and high-voltage materials
- Simplo | IT business and smartphone battery modules
- TI | Fuel gauging and protection for mobile-phone packs
- Huaqin | Smartphone and tablet ODM
- FocalTech | Touch, display drivers and IDC/TDDI
- Sensortek | Ambient-light, proximity and color sensors