| Printed Circuit Boards → PCB recovery and separation | Boards and production scrap A role-level PCB waste route, not a contract with a named board maker. | Chinalab | PCB resource recovery 2026-10-30 |
| Copper-Clad Laminate → PCB recovery and separation | Copper-clad laminate scrap Chinalab lists copper-clad laminate waste; this does not cover every material grade. | Chinalab | PCB resource recovery 2026-10-30 |
| Semiconductor Packaging → IC and packaging scrap recovery | Scrapped ICs and components Scrapped ICs can enter material recovery by composition, distinct from repair and resale. | JYD | Electronic scrap and metal recovery 2026-10-30 |
| Electronic scrap collection → PCB recovery and separation | Sorted board processing Classification precedes treatment selection, within one company or across providers. | JYD | Electronic scrap and metal recovery 2026-10-30 |
| Electronic scrap collection → IC and packaging scrap recovery | IC and component segregation Waste ICs and components are segregated by material condition. | JYD | Electronic scrap and metal recovery 2026-10-30 |
| PCB recovery and separation → Recovered metal refining | Metal-bearing feed for refining Separated metal-bearing material can enter refining; no universal supplier relationship is implied. | JYD | Electronic scrap and metal recovery 2026-10-30 |
| IC and packaging scrap recovery → Recovered metal refining | Valuable metal recovery Recoverable metal types and value depend on batch analysis. | JYD | Electronic scrap and metal recovery 2026-10-30 |
| PCB Wet-Process Chemicals → Recovered metal refining | Metal-bearing process liquids Metal-bearing plating waste can enter recovery, not every PCB chemical stream. | JYD | Electronic scrap and metal recovery 2026-10-30 |
| Wafer Fabrication → Wafer reclaim | Eligible wafers sent for reclaim Suitable wafers are selected for stripping, polishing and cleaning. | PSI | Wafer reclaim services 2026-10-30 |
| Wafer reclaim → Wafer Fabrication | Reclaimed wafer reuse Reuse depends on wafer and process requirements; arbitrary device-wafer use is not implied. | PSI | Wafer reclaim services 2026-10-30 |
| Semiconductor Silicon Wafers → Silicon slurry recovery | Grinding and cutting by-products Based on the wafer grinding/cutting waste scope published by Semisils. | Semisils | Silicon slurry and acid recovery 2026-10-30 |
| Semiconductor Packaging → Silicon slurry recovery | Dicing and grinding waste Wafer dicing/grinding slurry requires composition-specific acceptance and treatment. | Semisils | Silicon slurry and acid recovery 2026-10-30 |
| Wafer Fabrication → Organic solvent recovery | Spent organic solvents Shangda discloses IC-manufacturing services, without naming a customer here. | Shangda | Waste solvent purification 2026-10-30 |
| Semiconductor Packaging → Organic solvent recovery | Packaging and test solvents Shangda lists packaging/test customers by sector; treatment depends on stream type. | Shangda | Waste solvent purification 2026-10-30 |
| Wafer Fabrication → TMAH developer recovery | Spent developer recovery A semiconductor waste source, not an undisclosed San Fu customer relationship. | San Fu Chemical | TMAH recycling and subsidiary investment 2026-10-30 |
| Wafer Fabrication → Waste acid regeneration | Spent sulfuric acid treatment Semisils discloses semiconductor waste acid as feedstock; output is industrial grade. | Semisils | Recovered industrial sulfuric acid 2026-10-30 |
| Organic solvent recovery → Process Chemicals and Gases | Return only when qualified TSMC solvent qualification example, not electronic-grade approval for all recyclers. | TSMC | Chemical waste reuse (2026-01-12) 2026-10-30 |
| TMAH developer recovery → Process Chemicals and Gases | Regenerated developer chemicals San Fu discloses TMAH regeneration; actual adoption depends on customer qualification. | San Fu Chemical | TMAH recycling and subsidiary investment 2026-10-30 |
| Chemical recovery systems → Organic solvent recovery | Solvent recovery equipment Describes equipment and treatment roles, not a contract with a named recycling plant. | Cica-Huntek | Chemical regeneration systems 2026-10-30 |
| Chemical recovery systems → Waste acid regeneration | Acid collection and segregation Describes equipment and treatment roles, not a contract with a named recycling plant. | Cica-Huntek | Waste liquid collection systems 2026-10-30 |
| Chemical recovery systems → TMAH developer recovery | Alkaline waste collection Describes equipment and treatment roles, not a contract with a named recycling plant. | Cica-Huntek | Waste liquid collection systems 2026-10-30 |
| Recovery analysis and quality checks → Recovered metal refining | Material composition analysis Checks can use internal or external capabilities; SDTI is not asserted to perform every validation. | SDTI | Analytical laboratory services 2026-10-30 |
| Recovery analysis and quality checks → Organic solvent recovery | Reuse quality assessment Checks can use internal or external capabilities; SDTI is not asserted to perform every validation. | TSMC | Chemical waste reuse (2026-01-12) 2026-10-30 |
| Recovery analysis and quality checks → Wafer reclaim | Wafer and surface metrology Checks can use internal or external capabilities; SDTI is not asserted to perform every validation. | PSI | Wafer reclaim services 2026-10-30 |
| AI Servers → IT asset retirement and reuse | Retired IT hardware Servers may enter ITAD on retirement; no named manufacturer contract is implied. | ERI | IT asset disposition and tracking 2026-10-30 |
| Smartphones → IT asset retirement and reuse | Retired mobile devices Routing depends on device condition and data requirements, without naming a phone brand. | ERI | IT asset disposition and tracking 2026-10-30 |
| IT asset retirement and reuse → Electronic scrap collection | Devices routed to material recovery Reuse and recycling are separate routes; not all retired assets become metal feedstock. | ERI | Refurbishment, remarketing and recycling 2026-10-30 |
| Printed Circuit Boards → Metal-bearing wastewater recovery | PCB process copper-bearing liquids An applicable process source, not a contract with a company shown elsewhere. | WASTE Recovery Technology | RecoCell electrowinning 2026-10-30 |
| Wafer Fabrication → Metal-bearing wastewater recovery | Metal-bearing fab wastewater An applicable process source, not a contract with a company shown elsewhere. | WASTE Recovery Technology | RecoCell electrowinning 2026-10-30 |
| Chemical recovery systems → Metal-bearing wastewater recovery | Electrowinning systems and operation BOO may combine equipment investment and operation; distinguish the activities. | WASTE Recovery Technology | RecoCell electrowinning 2026-10-30 |
| Metal-bearing wastewater recovery → Copper recovered from wastewater | Electrowon solid copper Based on disclosed RecoCell output; specifications depend on feedstock and process conditions. | WASTE Recovery Technology | RecoCell electrowinning 2026-10-30 |
| Recovery analysis and quality checks → Copper recovered from wastewater | Metal content and quality assessment Output purity requires verification; no particular assay provider is asserted. | WASTE Recovery Technology | RecoCell electrowinning 2026-10-30 |
| Insoluble anodes for PCB plating → Printed Circuit Boards | Anodes for electroplating Anode supply into plating, not spent titanium mesh sent for recycling. | WASTE Recovery Technology | De Nora anodes and titanium fabrication 2026-10-30 |
| Recovered metal refining → Gold salts and precious-metal materials | Qualified high-purity metal feedstock Gold salts use high-purity gold; this role-level route does not establish recycled origin or a named refiner for every batch. | SDTI | Gold salts and application materials 2026-10-30 |
| Gold salts and precious-metal materials → PCB Wet-Process Chemicals | Gold salts for plating SDTI describes PCB gold-plating uses; this is not evidence of a named board maker purchase. | SDTI | Gold salts and application materials 2026-10-30 |