ENGLISH OVERVIEW
High-Density Interconnect PCBs
Microvias and fine circuits for dense component connections
HDI combines microvias, fine traces and sequential build-up to fit more connections into less area. It helps route fine-pitch components but requires coordinated materials, laser processing, surface preparation, plating and alignment.
A connected manufacturing sequence
After laser drilling, desmear prepares the interface, metallization creates conduction and plating builds thickness or fills holes. Each result affects the following process.
- Glass and resin respond differently to lasers. Fine circuitry can use different additive or subtractive methods; HDI does not specify one single process.
Reliability and adjacent technologies
Misaligned holes, poor bottom contacts and plating voids can fail immediately or after thermal cycling. Sequential lamination repeatedly heats the existing structure.
- HDI can coexist with high layer counts. Similar microvia concepts in package substrates do not mean the dimensions, equipment and qualification requirements are interchangeable.
Connected industry roles
Links describe supply, classification, technology or services. They do not establish transactions between individual companies.
Printed Circuit Boards → High-Density Interconnect PCBs
Interconnect technology category
HDI describes microvias and dense routing and can overlap with high-layer-count designs.
TTM | HDI and microvia technologyHigh-Layer-Count PCBs ↔ High-Density Interconnect PCBs
Can be combined
A high-layer-count board can use HDI; not every HLC board requires it.
TTM | High-layer-count and processing capabilities for data-center PCBsCopper Foil for PCBs → High-Density Interconnect PCBs
Foil for some fine-line processes
Carrier-supported ultrathin copper can serve selected fine-line processes; it is not required for every HDI board.
Mitsui Kinzoku | Copper-foil product categoriesHigh-Density Interconnect PCBs → Smartphones
High-density mainboards
Space and interconnect requirements drive dense phone PCBs; board layers and processes vary.
AT&S | HDI and smartphone mainboardsCompany examples & product roles
Examples illustrate roles, not rankings or customer orders. Locations refer to headquarters, principal operations or the stated registration jurisdiction, not every production site.
ZDT ↗
HDI circuit boards
High-density interconnect and substrate-like boards with fine circuitry.
Official product / role sourceTTM Technologies ↗
HDI circuit boards
High-density interconnect PCB technologies including microvias and sequential build-up.
Official product / role sourceAT&S ↗
HDI circuit boards
HDI boards for dense, miniaturized electronic devices.
Official product / role source