ENGLISH OVERVIEW
ABF Build-up Film
An insulating material used to build package substrates
Ajinomoto Build-up Film is an insulating film developed by Ajinomoto for package substrates. Substrate makers laminate and cure the film, create microvias and copper circuits, and repeat the build-up where needed. The film is neither a finished substrate nor a chip.
Separate film suppliers from substrate makers
Ajinomoto supplies ABF film; companies such as Unimicron process materials into substrates. Formulation, dispersion, film uniformity and defect control influence later lamination and circuit formation.
- A change in film grade requires the substrate maker to confirm its processing window.
Connect the layers correctly
Glass-reinforced cores and ABF build-up can coexist in one substrate. System-board CCL and prepreg are adjacent but different material roles.
- CoWoS growth does not directly determine ABF consumption: substrate area, build-up count, architecture and yield also intervene. Material release, trial production and end-product adoption are separate stages.
Connected industry roles
Links describe supply, classification, technology or services. They do not establish transactions between individual companies.
ABF Build-up Film → ABF Package Substrates
Build-up insulation
Substrate makers process film into multilayer interconnects; a material-to-finished-product relationship.
Ajinomoto | ABF build-up dielectric materialsABF Build-up Film → Glass Build-Up Layers and RDL Wiring
Optional: ABF build-up insulation
Intel's public patent includes ABF on both sides of a glass core, showing coexistence is possible; it is not evidence of a particular mass-produced product or an Ajinomoto customer order.
Intel published patent US20260005081A1 | Glass-core and ABF coexistence architectureCompany examples & product roles
This topic lists ABF film manufacturers; substrate makers appear in the downstream ABF package-substrate topic.
Ajinomoto ↗
ABF build-up insulating film developer
Develops and supplies Ajinomoto Build-up Film; downstream substrate manufacturing is listed under ABF package substrates.
Official product / role source