INDUSTRY ANALYSIS
Thin-Film Deposition analysis
Explore companies, technologies and supply chains. English translations are published in batches, with the original sources and dates preserved.
The Semiconductor Cycle Through ASML, TSMC, and Micron Earnings: Where Is Demand Strong, and Which Recoveries Remain Unconfirmed?
ASML’s equipment demand, TSMC’s advanced-node revenue, and Micron’s HBM supply agreements point to continued growth in the core AI supply chain.
Why AI Agents Drive CPU Demand: Workloads, Foundries, and the Named Supply Chain
As AI moves from answering questions to gathering information, operating software, running code, and repeatedly verifying results, data-center workloads are changing.
Innolux Enters RDL and Advanced Packaging: Large-Area Manufacturing Advantages, Production Hurdles, and Competitive Implications
As AI chips integrate more compute dies and memory into a single package, the industry’s challenge is expanding from making transistors smaller to connecting more chips while controlling packaging costs.
FOWLP vs. FOPLP: Fan-Out Packaging Advantages, Production Bottlenecks, and Costs
FOWLP and FOPLP are both forms of fan-out packaging. Their main difference is whether processing uses a circular wafer or a rectangular panel.