INDUSTRY ANALYSIS
Wafer Fabrication analysis
Explore companies, technologies and supply chains. English translations are published in batches, with the original sources and dates preserved.
The Semiconductor Cycle Through ASML, TSMC, and Micron Earnings: Where Is Demand Strong, and Which Recoveries Remain Unconfirmed?
ASML’s equipment demand, TSMC’s advanced-node revenue, and Micron’s HBM supply agreements point to continued growth in the core AI supply chain.
Why AI Agents Drive CPU Demand: Workloads, Foundries, and the Named Supply Chain
As AI moves from answering questions to gathering information, operating software, running code, and repeatedly verifying results, data-center workloads are changing.
HBM4 and HBM4E Technology and Supply Chains: How the Three Major Suppliers Combine Memory Processes and Advanced Packaging
Competition in HBM4 and HBM4E spans DRAM dies, logic base dies, and stacked packaging. SK hynix, Samsung, and Micron use different process combinations, creating distinct roles for foundries, bonding-equipment makers, packaging-material suppliers, test provide…
PCs May Cool First: Why HBM Demand Could Last Longer, and What It Means for Taiwan's Memory Industry
PCs and AI servers face different memory cycles. Higher end-product prices and brand inventories may slow PC purchasing first, while AI deployment, inference, and long-context applications could extend HBM demand growth.
FOWLP vs. FOPLP: Fan-Out Packaging Advantages, Production Bottlenecks, and Costs
FOWLP and FOPLP are both forms of fan-out packaging. Their main difference is whether processing uses a circular wafer or a rectangular panel.