High-Bandwidth Memory

Different from a server memory module

HBM uses stacked dies and close package connections rather than a conventional replaceable DIMM. It is not a memory module users can simply swap.

• Thin dies, TSVs and stacking increase alignment, defect-control and thermal-management requirements.

Packaging and memory must be qualified together

CoWoS is one packaging option for integrating HBM with logic. Their qualification and supply schedules interact.

• Compare memory generation, stack configuration, bandwidth and capacity rather than treating every HBM product as identical.

Separate memory vendors, base dies and manufacturing

HBM product vendors include SK hynix, Samsung and Micron. TSMC, PSMC and Phison have distinct roles.

• TSMC: SK hynix HBM4 logic-base-die cooperation and CoWoS integration.
• PSMC: announced Micron HBM/PWF manufacturing cooperation; its WoW platform is listed separately.
• Phison: aiDAPTIV uses NAND for capacity extension; that does not make Phison an HBM DRAM manufacturer.
• HBM requires DRAM design, TSVs, thinning, precise stacking, testing and thermal engineering, not stacking finished DDR5 parts.

Connected industry roles

Links describe supply, classification, technology or services. They do not establish transactions between individual companies.

Company examples & product roles

HBM die and stacked-memory manufacturing, base logic-die foundry services, and package integration are different roles.