ENGLISH OVERVIEW
IC Package Substrates
Bridging fine chip connections to the system board
An IC package substrate carries fine-pitch chip or interposer connections to a scale the motherboard can accept. It belongs to the package, not the server motherboard. Fine traces, microvias, flatness and dimensional control are central challenges.
Material, substrate and package are distinct
ABF substrates are one type of IC substrate. ABF forms insulating build-up layers; the completed substrate includes conductors and other structures. CoWoS is a package-integration technology family.
- A CoWoS interposer is also different from the organic substrate beneath it.
Fine routing requires coordinated processes
Some substrates use semi-additive processing: establish a thin conductive layer, then pattern-plate copper traces. Surface preparation, imaging and microvia interfaces must work together.
- A fine-line capability alone does not establish mature yield for large, multilayer packages. Assess package dimensions, layer count, material combination and reliability together.
Connected industry roles
Links describe supply, classification, technology or services. They do not establish transactions between individual companies.
Printed Circuit Boards ↔ IC Package Substrates
Adjacent product stages
Both use circuitry, insulation and microvias, but package substrates sit inside chip packages, not at the system-motherboard level.
IBIDEN | IC package substrates, SAP and microviasElectronic Glass Cloth → IC Package Substrates
Reinforcement in some organic cores
Special glass fibers can control core expansion and stiffness; this differs from the role of ABF build-up layers.
Nittobo | Electrical and thermomechanical requirements for specialty glass fiberIC Package Substrates → CoWoS Advanced Packaging
Package support and connections
The substrate supports CoWoS integration and connects to the system board; it differs from the interposer.
TSMC | CoWoS-S/R/LIC Package Substrates → Semiconductor Packaging
Support and interconnect for selected packages
Some packages use IC substrates; not every package requires an organic substrate.
Amkor | Semiconductor package typesIC Package Substrates → ABF Package Substrates
A type of package substrate
ABF substrates are IC package substrates; the classification does not imply making a generic substrate first and then an ABF substrate.
Ajinomoto | ABF build-up dielectric materialsIC Package Substrates → Glass-Core Package Substrates
Substrates with glass cores
One IC package-substrate architecture; not every substrate uses a glass core.
TOPPAN | Glass-core FC-BGA and glass interposersBT resin systems → IC Package Substrates
Suitable BT grades for package substrates
This is a representative feed, process or material relationship, not a vendor contract; not every reagent or operation is shown.
MGC | BT resin and laminatesCompany examples & product roles
Examples illustrate roles, not rankings or customer orders. Locations refer to headquarters, principal operations or the stated registration jurisdiction, not every production site.
Unimicron ↗
IC package substrates
IC substrates connecting chip packages to system circuit boards.
Official product / role sourceNan Ya PCB ↗
IC substrate manufacturing
IC and ABF package substrates; a different role from supplying ABF insulating film.
Official product / role sourceKINSUS ↗
IC substrate manufacturing
IC substrates for logic, computing and memory chip packages.
Official product / role sourceIBIDEN ↗
IC package substrates
High-density IC substrates for flip-chip packaging.
Official product / role source