Companies, organized by role

S-82L1/T1/U1/V1 products list smartphone applications and alarm functions.

Conductive SiC substrates and epitaxial products.

Published epitaxial materials and GaN-on-Si structures.

Silicon epitaxial wafers and other compound-semiconductor epitaxy services.

Published silicon power-device, SiC and GaN manufacturing services.

Published device development for 800 V architecture; verify status by product.

GaNFast power devices and development for 800 V architecture.

AC/DC transformers and power ferrites selected by specification.

Published conductive-polymer, hybrid and aluminum electrolytic products.

Conductive-polymer solid aluminum capacitors for server power supplies.

AN series lists power-supply applications, not universal server qualification.

MLCC materials and device technology; qualify specifications by part.

Published epoxy, silicone and other encapsulants; use depends on the product design.

Published design-to-manufacturing services; other products include AI PCs.

Named in the company profile; no phone model or production volume is specified.

Named in the company profile; no phone model or production volume is specified.

Named in the company profile; no phone model or production volume is specified.

Named in the company profile; no phone model or production volume is specified.

Published design-to-production smartphone solutions across price tiers.

Communications includes smartphones; segment revenue is not phone-only revenue.

Design and manufacturing of smartphones and other communications products.

Published display drivers and AMOLED integration solutions.

Published phone touch products; distinguish them from IDC/TDDI.

Published LCD and AMOLED touch/display integration.

Published smartphone fingerprint products and commercial customers.

Listed under smartphone fingerprint applications; no model, volume or period is specified.

Listed under smartphone fingerprint applications; no model, volume or period is specified.

Listed under smartphone fingerprint applications; no model, volume or period is specified.

Listed under smartphone fingerprint applications; no model, volume or period is specified.

Display-driver, touch and fingerprint-sensing ICs.

Phone touch-controller ICs and solutions.

Capacitive, optical in-display and ultrasonic products.

The 2026-09-23 announcement identifies touch controllers and ultrasonic fingerprint sensing in Xiaomi 18 Pro models.

ALS, PS, RGB and flicker sensing; distinct from camera CIS.

Named in the 2025 report; individual sensor models are not mapped to the brand.

Named in the 2025 report; individual sensor models are not mapped to the brand.

Named in the 2025 report; individual sensor models are not mapped to the brand.

Named in the 2025 report; individual sensor models are not mapped to the brand.

Published communication fiber cables; no fixed 1.6T link rating inferred from cable alone.

MPO, patch cords and related passive fiber products.

Features list 30 m OM3 / 50 m OM4 with FEC, while the model introduction lists 3 m; confirmation needed.

Fiber connections and related optical-communications components.

50 m target and 12 W design power per end; shipments planned for 2027.

Published ZeroFlap AEC; reach depends on rate, connector and model.

Waste treatment and resource recovery for IC, PCB and other electronics sectors.

Disclosed service coverage includes PCB and electronic waste.

IC-industry services; not restoration of chip function.

Published acceptance of ICs, chips, gold-plated boards and PCBA scrap.

Published analysis services; confirm the scope for specific tests.

Gold plating materials for PCBs, connector wires and lead frames.

Electronic components, boards and metal-bearing liquids.

Collection and processing of waste boards according to metal composition.

Published acceptance of waste ICs and electronic components.

Gold, silver, palladium and platinum refining and metal-bearing liquid recovery.

Retired devices routed into electronic waste processing.

Asset disposition, sanitization and routing to reuse or recycling.

Crushing and separation into copper powder and nonstructural concrete additives.

Recovery of gold, silver, platinum, palladium and other elements by waste type.

Stripping, polishing, cleaning and metrology; new test wafers are a separate product.

Reclaimed and test wafers and wafer-thinning services.

Recovery of semiconductor grinding/cutting slurry and silica products.

Semiconductor waste acid regenerated into industrial-grade product.

IPA, PMA, acetone and NMP, without assuming electronic grade for all products.

Chemical segregation, distillation, filtration and regeneration systems.

RecoCell systems and operation/maintenance services.

RecoCell metal recovery configured for the wastewater stream.

RecoCell discloses solid copper with copper content above 99%.

DT-series anode distribution plus custom titanium frames and fixtures.

PC/PET/PMMA with UV coatings; not a raw-polymer supplier designation

Design matched to pixel layout and viewing distance

Engraving, UV curing, cutting and lamination; not a standalone tool-sales designation

Proprietary UV-curable nanoimprint resins

Roll-to-Plate equipment and flexible stamps

Liquid-crystal optics and Immersity platform

Switchable 3D optics and software integration

Structured-light WLO and image processor; CES 2025 demonstration

3D Display Pixel Weaving; publicly demonstrated solution

IR LEDs, LED/VCSEL drivers and image sensing

Computers and tablets

Server design and manufacturing services.

Design and manufacturing of smartphones and other mobile devices.

PC/NB, EC and Super I/O

Super I/O, keyboard controllers, embedded controllers and related chips.

USB, PCIe and SATA control

USB, PCIe, SATA and other interface chips; PCIe switches are distinct from Ethernet switch ASICs.

Laptop adapters and GaN designs

Power supplies for servers and communications equipment.

Light-metal enclosure capabilities for notebooks and tablets

Metal housings, frames and internal structures for smartphones.

Notebook, tablet and AIO/LCD hinges