IndustryAtlasSUPPLY CHAIN HANDBOOK
Connect switch silicon and systems with lasers, optical engines, fiber and receivers, and compare cable reach and applications. Distinguish components, modules and packaging architectures instead of treating pluggable optics, silicon photonics and CPO as the same product.
The electrical-to-optical conversion point moves. Pluggables place it near front-panel ports; CPO places optical engines on a shared packaging platform with the switch chip, shortening high-speed electrical paths. Lasers, modulation, receivers and fiber connections remain necessary, but their assembly, testing and servicing change. Trace a data path first, then distinguish chip, optical-component, module and switch suppliers to see which tasks move when the architecture changes.
The ASIC processes packets and supplies electrical interfaces. Drivers and photonic devices move that data into optical channels; pluggable, NPO and CPO layouts locate and integrate this connection differently.
Lasers supply light, modulators encode data, and photodetectors with TIAs recover electrical signals. Coupling, packaging and testing combine these functions into units that connect to fiber.
Passive fiber carries light; an AOC also includes end conversion. System integration matches ports, reach, routing and servicing, then validates the complete channel.
Start with reach and interfaces, then compare power, replacement and integration. Pluggables allow separate module replacement; moving optics toward the ASIC shortens electrical paths but changes packaging and service arrangements.
A network switch combines a switching ASIC, ports, board circuits, software and cables or optical modules. AI-cluster traffic makes switching capacity, port density, power and reliability important design conditions.
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A switch ASIC forwards packets within a switch. Chip suppliers design the architecture and interfaces; system providers integrate the chip with boards, power, optics and software into complete equipment.
Broadcom, NVIDIA and Marvell offer switch chips for different network uses. A company name alone cannot compare their capabilities.
NVIDIA supplies Spectrum chips and switch systems; Cisco provides branded equipment and Silicon One chips.
Distinction: A role node and representative company list do not establish specific supply contracts between the named companies.
Lists chip-product roles; see adjacent topics for brands and design/manufacturing. Cisco Silicon One also appears in the full directory.
Tomahawk, Jericho and other switching and routing chips.
Product / role sourceSpectrum Ethernet switch chips and related SDKs; complete systems are listed separately.
Product / role sourceEthernet switch chips for enterprise, data-center, industrial and other markets.
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Branded system providers deliver switches, network operating systems, management tools and support. They can purchase merchant chips or develop their own, with manufacturing arranged for each product.
Cisco, Arista and other providers integrate hardware, software, network management and support; NVIDIA also supplies switch systems.
Brands can commission ODM or EMS partners for design or production. Some open platforms are supplied directly to cloud customers.
Distinction: Representative companies illustrate roles, not a complete directory or specific supply agreements.
Brands and system solutions extend beyond hardware branding to software, integration and customer support.
Data-center, campus and other switches and network-management solutions.
Product / role sourceSwitches, EOS network operating systems and CloudVision management platforms.
Product / role sourceSupplies switch systems including Spectrum, separately from its chip-design role.
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This role covers board design, signal and thermal validation, assembly, testing and supply-chain management. ODMs can participate in design; EMS providers emphasize manufacturing services. Actual responsibilities depend on the contract.
Accton supplies networking ODM design and manufacturing. Celestica supplies manufacturing services and open switch platforms. These roles integrate chips rather than fabricate switching ASICs.
Chip, system-brand and manufacturing roles do not require three separate companies in a fixed sequence for every switch.
Distinction: Role links are not evidence of a particular supply contract, and representative company lists are not exhaustive.
Manufacturers may also offer complete hardware platforms; their role cannot always be reduced to contract assembly.
Switch, router and other ODM solutions; official examples include integration of Broadcom chips.
Product / role sourceDesign and manufacturing solutions for high-speed data-center Ethernet switches.
Product / role sourceHardware platforms, design and manufacturing services, and open switches for cloud and other uses.
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Silicon photonics integrates waveguides, modulators and detectors on a silicon-based platform for transceivers, optical engines or optical I/O. It describes a technology; CPO describes how optics and electronic chips are packaged together.
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An optical engine combines photonic devices, driver and receiver electronics, and optical coupling to convert data between electrical and optical forms. It may sit near an ASIC or inside a module; the product definition determines which components it includes.
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Some optical links directly modulate a laser; others use continuous-wave light that an optical engine modulates. CPO discussions often feature external lasers because temperature, lifetime and replacement must be considered with the package as a whole.
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Fibers carry light, while cables, connectors and fiber arrays turn them into usable assemblies. Data centers must consider distance, fiber count, loss, bend space and maintenance. Optics near the chip also make internal fiber routing part of system design.
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CPO integrates optical engines and chips such as switch ASICs on a shared package platform to shorten high-speed electrical paths. Near-packaged optics places engines nearby without that shared packaging. Benefits must be compared for specific products at the same system boundary.
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Pluggable transceivers convert electrical and optical signals at network ports. They can be selected for link distance and fiber type and replaced individually. Matching form factors do not guarantee matching wavelengths, transmission specifications or host compatibility.
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Explore data center optical interconnects through shared upstream roles, pluggable modules and CPO. Optical communications is an application domain, silicon photonics a technology, and CPO an integration architecture.
Lasers, photonic components, fiber and manufacturing services can support multiple routes. Shared suppliers do not imply interchangeable parts. This map does not yet fully cover DCI, metro/backbone transport or PON access.
The cable view separates passive fiber cables, AOC, micro-emitter ALC and copper, linking back to transceivers, emitters, receiver electronics and systems. Selection requires compatible speed, reach, protocol, connectors and deployment readiness.
Laser Light SourcesSilicon PhotonicsOptical drivers & receiversPluggable Optical TransceiversOptical manufacturing servicesCPO integration & packagingCPO platforms & systemsOptical receiver supply chainPassive fiber cables and patch cordsActive optical cables (AOC)Micro-emitter optics / ALCHigh-speed copper: DAC / ACC / AEC
Distinction: Pluggable optics and CPO are not a simple old-versus-new replacement; compare reach, power, density and serviceability.
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DSP-based pluggable modules use optical DSPs for high-speed data interfaces. DSP chip suppliers and finished transceiver vendors perform different roles.
Marvell offers optical DSPs for high-speed pluggable modules. Equalization, retiming and diagnostics vary by device. LPO omits the module DSP, so this is not a mandatory component in every optical path.
Distinction: Removing the module DSP still requires compatible host and analog links; it does not make the module CPO.
Scope of these company examples
Offers PAM4 optical DSPs for pluggable modules; these are chips, not finished modules.
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Drivers feed optical modulators, while TIAs and receiver electronics process signals from photodetectors. These electronic functions serve transceivers and optical engines.
PICs and EICs must be designed together. Pluggable, LPO and CPO interfaces differ in linearity, power and integration requirements; one device is not automatically compatible with all three.
Distinction: Analog drive/receive functions, optical DSPs and photonic components are distinct product roles.
Scope of these company examples
Publishes optical driver and receiver chips, including an LPO chipset.
Product / role sourcePublishes driver and TIA functions paired with silicon-photonics components.
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Precision manufacturing services support customer transceivers and optical engines. This role is separate from own-brand products and semiconductor wafer foundries.
Fabrinet publishes laser packaging, optical alignment and system integration capabilities. These capabilities do not establish each customer, model, contract or production volume.
Distinction: Contract manufacturing revenue is not own-brand transceiver market share.
Scope of these company examples
Customer manufacturing services spanning laser packaging, active alignment and system integration.
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LPO retains the pluggable form factor and uses linear drive and receive paths without a module DSP. It still relies on compatible host-side signal capabilities.
Marvell publishes an LPO TIA and laser-driver chipset. This is a component example, not a claim that Marvell supplies finished LPO modules. Qualification covers the module, host and channel together.
Distinction: LPO is pluggable; low power or the absence of a module DSP does not imply co-packaging.
Scope of these company examples
A component role, not a finished LPO module brand or a customer shipment claim.
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ELS separates light generation from major electronic heat sources and supplies continuous-wave light to optical engines. Some products use replaceable ELSFP modules.
NVIDIA describes ELS-based architectures and Coherent demonstrates ELS-based CPO. Intel also has integrated-laser optical I/O. External lasers are an option rather than a universal CPO requirement.
Distinction: ELSFP primarily supplies light; it is not an OSFP-style data transceiver.
Scope of these company examples
Publishes UHP lasers and ELSFP light-source solutions for CPO, distinct from data transceivers.
Product / role sourceDemonstrated ELS using its InP CW lasers in 2026; a demonstration does not establish customer volume shipments.
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Fiber coupling connects fibers precisely to photonic chips or optical assemblies, controlling loss while supporting scalable assembly and serviceability.
Alignment, connector cleanliness, thermal drift and assembly yield affect optical power budgets. Fiber arrays, connectors and active-alignment services are distinct deliverables and can also support pluggable modules.
Distinction: Supplying an FAU or connector does not imply manufacturing laser dies or switch ASICs.
Scope of these company examples
Optical manufacturing services include active and passive alignment, separate from own-brand fiber components.
Product / role sourcePublishes FAUs, fiber harnesses and optical assembly components; this does not establish laser-die fabrication.
Product / role sourcePublishes detachable optical connectors and a NVIDIA photonics collaboration; roles and volumes remain product-specific.
Product / role sourcePublishes fiber arrays, passive optical subassemblies and related integration for optical modules and CPO.
Product / role sourcePublishes fiber coupling for silicon photonics/CPO; this role does not establish Ge or InGaAs PD fabrication.
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Integrate photonic and electronic dies with package interfaces while addressing heat, yield and testing. Manufacturing platforms and assembly providers have distinct responsibilities.
TSMC COUPE is an electro-optical manufacturing platform; SPIL participates in packaging, assembly and test. Known-good components and early testing reduce the risk of discovering defects after costly integration.
Distinction: A manufacturing platform, packaging service and optical engine product are not the same supplier role.
Scope of these company examples
Supports PIC/EIC and engine integration through a manufacturing platform; not a switch-system brand.
Product / role sourceA published NVIDIA optical packaging and test role; not a claim to perform every interposer process.
Product / role sourcePublishes a CPO technology demonstration, not evidence of a particular customer volume receiver order.
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CPO platforms integrate optical I/O into switching architectures. System integration then addresses power, cooling, fiber routing and serviceability, with platform and assembly roles distinguished.
NVIDIA and Broadcom offer different CPO platforms. Foxconn has a published switch assembly and integration role. Materials, speeds and commercial milestones must be checked for each platform.
Distinction: Ecosystem membership does not establish volume orders for every model or an exclusive supplier list.
Scope of these company examples
Quantum-X Photonics and Spectrum-X Photonics are separate switch platforms with distinct specifications.
Product / role sourcePublishes its own CPO switch platform; assess the particular product rather than combining different vendors specifications.
Product / role sourceNVIDIA publishes a Spectrum-X Photonics switch system integration role, separate from laser and ASIC manufacturing.
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Trace detector materials and fabrication through receiver electronics, optical coupling, assembly and test into pluggable modules and CPO engines. This view focuses on direct-detection data center receivers in the 1310/1550 nm bands.
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InP substrates provide a growth platform for many communications InGaAs detectors. Epitaxy, device fabrication and testing follow; the substrate itself is not a completed PD.
AXT publishes InP substrate applications in communications lasers and detectors. Device processes set wafer quality, size and defect requirements. This map does not infer purchasing relationships between AXT and the other companies shown.
Distinction: InP names a substrate or material platform, not a guarantee that every InP optoelectronic product is an InGaAs PD.
Scope of these company examples
Publishes InP substrates for communications lasers and detectors, rather than PD dies or complete receivers.
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Epitaxy forms the absorber and junction stack. Communications InGaAs PDs commonly use an InP platform, with different layer structures for PIN, APD and other device designs.
IQE publishes InP PD/APD epitaxy capabilities, an upstream wafer-stack role. Its portfolio does not establish every customer absorber recipe or a finished high-speed receiver. Epitaxy and die fabrication may be outsourced separately or integrated within one supplier.
Distinction: PIN and APD describe device structures; InGaAs and Ge describe absorber materials. They are not one mutually exclusive classification.
Scope of these company examples
Publishes InP detector epitaxial structures; this page does not confirm each customer InGaAs absorber recipe.
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InGaAs absorber structures become detector dies or arrays that are integrated with receiver electronics and optical interfaces. Products may be delivered as bare dies, carriers or packaged devices.
GCS, Albis, Broadcom and MACOM publish specific PD products explicitly identified as InGaAs. Albis PD50Y1 targets 200G PAM4, showing an ongoing high-speed role. The other cited parts have their own rates and uses and are not equivalent substitutes.
Distinction: A Broadcom InGaAs PD brief does not establish the detector material in all of its CPO products. Component suppliers need not supply complete modules.
Scope of these company examples
Lists 1310/1550 nm InGaAs PIN dies and arrays, including 56G parts; specifications remain model-specific.
Product / role sourcePD50Y1 explicitly lists InGaAs/InP, 200G PAM4 and die/carrier formats; a PD component role.
Product / role sourceThe LPD3030 brief identifies a 28 Gb/s InGaAs PIN; this does not establish PD materials across Broadcom CPO products.
Product / role sourceMARP-MP10A explicitly identifies InGaAs PIN; it establishes that component material, not a designated 200G or CPO receiver BOM.
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The silicon and buried-oxide layers in SOI support silicon-photonics waveguides. Detectors and other functions are added in subsequent photonic fabrication, rather than arriving as completed devices on a starting SOI wafer.
Soitec supplies Photonics-SOI starting material. A silicon-photonics process then adds Ge absorber regions, junctions, metallization and other photonic components. SOI suppliers and foundries producing PICs with Ge PDs perform different roles.
Distinction: Ge-on-Si PDs do not imply a bulk germanium wafer or a direct one-for-one increase in germanium-substrate demand.
Scope of these company examples
Supplies silicon-photonics starting wafers; subsequent photonic processes form Ge PDs and PICs.
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Ge absorbers are integrated with silicon waveguides so that detection becomes part of a PIC. Buyers often obtain a photonic chip or foundry process containing PDs instead of a separate Ge detector die.
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Detectors made in a different material system can connect to a photonic platform through die attachment or other heterogeneous integration methods. InGaAs and silicon photonics are not isolated ecosystems.
Ansys documents an InP/InGaAs UTC PD coupled to a silicon waveguide, demonstrating this design route rather than a commercial supply agreement. POET publishes compound-semiconductor integration on optical interposers, but that platform description does not establish the absorber material of every receiver PD.
Distinction: Heterogeneous integration can connect the process routes, but it is not required for every InGaAs receiver and does not make the processes identical to a Ge PIC.
Scope of these company examples
Publishes heterogeneous optical/electronic integration; the cited technology page does not establish each PD absorber, so this is not a blanket InGaAs classification.
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TIAs convert small detector photocurrents into usable voltage signals. InGaAs and Ge receivers both need suitable receiver electronics, matched to detector capacitance, bandwidth, bias and package interfaces.
Marvell, Semtech and MACOM publish optical-receiver TIA products. LPO imposes linear-link requirements that differ from other module designs. CPO can use adjacent EICs or other integration approaches to shorten photonic-to-electronic connections; placement and functions are architecture-specific.
Distinction: SiGe in a BiCMOS TIA describes an electronic transistor process, not evidence that the optical absorber is Ge. A shared supplier does not make its TIAs interchangeable.
Scope of these company examples
Publishes high-speed TIAs selected for linearity, PD capacitance and interface requirements; not a PD absorber supplier.
Product / role sourcePublishes optical-communications TIAs with distinct reach, data-format and rate requirements.
Product / role sourceIts 3.2T optical chipset announcement includes receiver TIAs; aggregate chipset rate is not a single PD bandwidth.
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Integrate a PD or PD-containing PIC with receiver electronics and optical interfaces, then incorporate the receive function into a transceiver or optical engine. Both detector routes share some integration capabilities at this stage.
Discrete-die designs assemble PDs, TIAs and optical components. Ge PICs integrate some optics on-chip but still require electronic attachment, power, thermal design and fiber coupling. Fabrinet manufacturing, POET interposer platforms and ASE packaging technologies are different deliverables, not equivalent complete-receiver products.
InGaAs photodetector dies & arraysSilicon-photonics PICs with Ge PDsReceiver TIAs & analog front endsFiber coupling & alignmentOptical manufacturing servicesOptical receiver measurement & test
Distinction: Receiver sensitivity, power and yield depend on the complete link, not solely on detector material.
Scope of these company examples
Capabilities include optical alignment and assembly; a manufacturing role, not a material determination for a specific receiver model.
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Measurement spans wafers, dies and assembled receivers. Early optical/electrical testing screens known-good devices; final qualification evaluates the full receive channel and reliability.
Keysight and FormFactor publish silicon-photonics wafer-test solutions spanning measurement and probing/wafer platforms. Equipment vendors, test services and packaging firms have distinct roles. Wafer-level data does not replace packaged-receiver sensitivity qualification.
Distinction: Testing is not a single component appended at the end. Service edges identify process stages, not evidence that every supplier uses particular equipment.
Scope of these company examples
Measurement equipment in the NX5402A silicon-photonics wafer-test solution; equipment supply is distinct from contract testing.
Product / role sourceKeysight documents CM300xi integration with its photonic measurement solution; this does not establish adoption by every PD supplier.
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Passive cables carry light without electrical-to-optical conversion. Fiber material, cable assembly and termination, and optical transceivers are different roles.
Cable makers select single-mode or multimode fiber and combine buffering, strength members and jackets. Patch cords add connector termination, polishing, cleaning and optical inspection. Steps depend on cable and connector design.
A passive cable does not independently establish a 1.6T, 500 m link. Transceivers, fiber type, connector loss and link budget jointly determine performance.
Distinction: The passive cable needs no active power, but transceivers and switches still consume power.
Scope of these company examples
Published communication fiber cables; no fixed 1.6T link rating inferred from cable alone.
Product / role sourceMPO, patch cords and related passive fiber products.
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An AOC integrates fiber with electrical-to-optical conversion at both ends and plugs into compatible electrical ports. Uses include server and switch links within or between data-center racks.
Typical steps include driver and receiver electronics, emitter and detector assembly, fiber alignment and coupling, endpoint packaging, and electrical, optical and complete-cable tests. Light sources and signal processing vary by architecture.
Check protocol, connector, speed and required reach first, then fiber, FEC, power and maintenance. An AOC is usually replaced as a complete cable; detachable transceivers and fiber can be managed separately.
| Product | Rate | Reach / medium | Power basis | Public status | Source / reviewed |
|---|---|---|---|---|---|
| Centera QSFP-DD AOC | 800G | 70 m OM3 / 100 m OM4 | 12 W per end; source labels typical/maximum inconsistently | Published product | Centera | 800G QSFP-DD AOC |
| Foxlink QSFP-DD AOC | 400G | Up to 100 m | <10 W per end | Published product | Foxlink | AOC products |
| Foxlink OSFP SR8 AOC | 800G | Undisclosed | Undisclosed | Published product; do not reuse the 400G reach | Foxlink | AOC products |
| EZconn QSFP-DD AOC | 800G | Features: 30 m OM3 / 50 m OM4 with FEC; model introduction: 3 m | <14 W per end | Different length statements on one page; confirm orderable length | EZconn | 800G QSFP-DD AOC |
| FIT OSFP AOC | 800G | 30 m OM4 | Module figure <12 W; two endpoints counted separately | Published catalog | FIT | External high-speed interconnect catalog |
Rows describe different products and reaches, not a power ranking. Undisclosed is not zero. Distinguish one endpoint from both, typical from maximum, and design targets from measurements. Review dates are not launch or production dates.
Distinction: AOC is a broad integrated active-cable form. Credo ALC names a particular micro-emitter architecture and product; the acronyms are not mutually exclusive industry standards.
Scope of these company examples
70 m OM3 / 100 m OM4; see table for ambiguous source power wording.
Product / role source400G lists up to 100 m; 800G reach is undisclosed.
Product / role sourceFeatures list 30 m OM3 / 50 m OM4 with FEC, while the model introduction lists 3 m; confirmation needed.
Product / role sourceCatalog OSFP AOC specifies 30 m OM4; do not substitute standalone SR8 transceiver reach.
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Many lower-rate optical channels carry a high-speed electrical interface in parallel, reducing the bandwidth needed per optical channel. Credo ZeroFlap ALC is a product example targeting short data-center links.
The platform can use micro-VCSELs or microLEDs with detector arrays, fiber bundles and endpoint electronics. Array fabrication, packaging, dense fiber alignment and channel testing matter; undisclosed process recipes and yields are not inferred.
On 2026-10-12, Credo announced 1.6T ZeroFlap ALC with a 50 m target and 12 W design power per end, with shipments planned for 2027. These are announced design parameters and timing, not measured volume-production results.
| Product | Rate | Reach / medium | Power basis | Public status | Source / reviewed |
|---|---|---|---|---|---|
| Credo ZeroFlap ALC | 1.6T | Target 50 m / fiber bundle | Design 12 W per end; about 24 W for both | Announced 2026-10-12; shipments planned for 2027 | Credo | 1.6T ZeroFlap ALC announcement and shipment plan |
Rows describe different products and reaches, not a power ranking. Undisclosed is not zero. Distinguish one endpoint from both, typical from maximum, and design targets from measurements. Review dates are not launch or production dates.
Distinction: A low-power 50 m design cannot replace a link requiring 500 m or 2 km. Equal aggregate speed is insufficient without matching reach, interfaces and deployment requirements.
Scope of these company examples
50 m target and 12 W design power per end; shipments planned for 2027.
Product / role sourceBizLink is named in the initiative; no confirmed ALC supply or order is implied.
Product / role sourceFoxlink is named in the initiative; distinguish this from its AOC product role.
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High-speed copper serves short equipment links. DAC is passive direct attach, ACC adds active analog compensation, and AEC uses active electronics for signal recovery. Terminology and implementation require model-level checks.
Length, wire gauge, bend radius and connectors affect loss. Compensation or retiming can extend reach while adding active power. Cable assembly, termination, electronics and signal-integrity testing are distinct tasks.
Copper and AOC overlap in some intra-rack and adjacent-rack uses. Reach changes with speed and model; no single distance describes all DAC or AEC products.
| Product | Rate | Reach / medium | Power basis | Public status | Source / reviewed |
|---|---|---|---|---|---|
| FIT OSFP DAC | 800G | Up to 2 m / copper | Passive cable; host power excluded | Published catalog | FIT | External high-speed interconnect catalog |
| FIT QSFP-DD ACC | 800G | Up to 4 m / copper | <1.3 W per end | Published catalog | FIT | External high-speed interconnect catalog |
| FIT OSFP AEC | 800G | Up to 7 m / copper | By version: CDR <5 W/end; DSP <12 W/end | Published catalog; power differs by version | FIT | External high-speed interconnect catalog |
Rows describe different products and reaches, not a power ranking. Undisclosed is not zero. Distinguish one endpoint from both, typical from maximum, and design targets from measurements. Review dates are not launch or production dates.
Distinction: Copper is an electrical interconnect, not an optical cable. This shared comparison view supports selection; it is not a mandatory serial supply chain.
Scope of these company examples
800G catalog examples reach up to 2 m, 4 m and 7 m respectively; power depends on version.
Product / role sourcePublished ZeroFlap AEC; reach depends on rate, connector and model.
Product / role sourcePublished high-speed I/O solutions including DAC/AEC.
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