Companies, organized by role

CPU/GPU multiphase PWM controllers, power stages and battery-protection chips.

Precision carbon materials for semiconductor applications.

Low-dielectric-loss resins for high-frequency circuit boards.

Low-power edge AI, audio-processing and human-machine interaction solutions.

Touch-sensor glass and cover glass for phone, tablet and other displays.

Server enclosures, rail brackets and mechanical components.

Contract semiconductor assembly and testing.

Contract semiconductor assembly and testing.

Distribution and integration of servers, storage, networking and HPC platforms.

Driver ICs for LCD, AMOLED and other displays.

Flexible circuits, PCBs and electronic modules.

Flexible circuits, PCBs and electronic modules.

Air-cooling, vapor-chamber and liquid-cooling modules.

Zyxel Holdings supplies switches and networking equipment through Zyxel Networks and other subsidiaries.

Multilayer, HDI and high-frequency, high-speed boards.

Multilayer, HDI and high-frequency, high-speed boards.

Multilayer, HDI and high-frequency, high-speed boards.

Public high-frequency, high-speed PCB applications include satellite antennas and LEO satellites; no particular customer is inferred.

Industrial edge AI computers, machine vision and embedded platforms.

AI, high-performance computing and cloud-server platforms.

DDR modules and low-power memory products.

Display-driver and touch-integration ICs through the ILITEK group.

Optical-transceiver design, R&D, production and sales.

GaN/SiC devices, epitaxy and wafer manufacturing through group companies including Guan Ya and Ji Ya.

Audio, imaging, home-entertainment and other multimedia SoCs.

Mechanical-component design and manufacturing for servers and cloud equipment.

Thin-film filters for active and passive optical-communications components.

Semiconductor distribution and application-solution support.

Solder, solder paste and related materials for packaging and wafer bumping.

Gases and chemicals for electronics and semiconductors; purity and process suitability follow product specifications.

Power-management, monitoring and other control ICs.

Glass and plastic optical lens elements and assemblies.

Copper and copper-alloy sheet for semiconductor electronics; distinct from PCB copper foil.

NAND Flash, DRAM module and storage-product distribution.

Smart-retail and self-service equipment with image recognition and AI.

MCUs and peripheral ICs for IoT, power management, edge AI and other applications.

Distribution and application services for semiconductors, power-management ICs and electronic components.

Embedded GPU, edge AI and rugged computing for industry and machine vision.

Rugged computing and control platforms for robots, AMRs and autonomous systems.

Cleanroom storage, handling and logistics automation for semiconductor facilities.

Handling and factory automation for PCB and ABF/BT substrate manufacturing.

Polarizers for LCD panels.

Low-noise block downconverters for satellite reception; not classified here as complete LEO user terminals.

D-Link enterprise switches and network systems.

Small six-axis robot arms and precision motion-control products.

Chip packaging and final-test services.

Chip packaging and final-test services.

AI cameras, 3D sensing modules and image-recognition integration.

3D depth cameras and vision-sensing modules for robots.

Crystal oscillators for servers, data centers and communications equipment.