Companies, organized by role

IC packaging and testing services.

IC packaging and testing services.

Quartz crystals and oscillators for servers and communications equipment.

FCCL base materials for flexible printed circuits.

FCCL processed by flex-board manufacturers, not finished flexible circuitry.

Discrete power components for power circuits.

AOI, X-ray and electrical-test equipment for PCB assemblies.

SMT assembly for electronic IT products; distinct from bare-board manufacturing.

Microcontrollers, battery-management, security and related chips.

Vapor chambers, heatsinks and liquid-cooling components.

Hardware and software integration for industrial IoT, machine vision and cloud management.

Custom ASIC design and chip volume-production integration.

Internally developed, silicon-proven IP for ASIC design.

Mini LED backlighting and RGB direct-view LED solutions.

High-purity solvents for semiconductor, display and packaging processes.

PCB automated optical inspection and electrical-test equipment.

Automated optical inspection for wafers and packaged chips.

Packaging and testing of custom semiconductor modules and image sensors.

Packaging and testing of custom semiconductor modules and image sensors.

Capacitor and other component distribution for servers and power applications.

Distribution of memory, system ICs and other electronic components.

ShunSin Holdings provides communications and semiconductor-module packaging and testing through subsidiaries.

ShunSin Holdings provides communications and semiconductor-module packaging and testing through subsidiaries.

Optical-transceiver packaging and manufacturing through ShunSin subsidiaries.

Complete display products including LCD monitors and projectors.

Autonomous mobile robots, robot control and factory-automation integration.

FOUP storage, wafer transport and factory-automation systems.

Display applications for phones, wearables, tablets and industrial equipment.

Wafer-level AOI, measurement and AI vision inspection equipment.

Functional bonding materials for optoelectronics and semiconductors.

Printed circuit board manufacturing and electronic-product assembly.

Electronic-grade ammonia water and other semiconductor-process chemicals.

Leadframes for IC and power-component packages.

High-speed data-center optical cables, optoelectronic modules and connectivity.

Embedded AI systems, modules and motherboard platforms.

AI, HPC and enterprise server platforms.

Vacuum laminators for IC substrate and circuit-board processes.

Optical lens elements and assemblies for cameras and phones.

3D LiDAR and optical sensing components for robot vision.

Distributes IC packaging materials and equipment, with manufacturing extended through group investments.

Printed circuit board manufacturing.

HTC smartphone products.

Dynamic Holding subsidiaries manufacture PCBs, high-layer-count boards and HDI boards.

Dynamic Holding subsidiaries manufacture PCBs, high-layer-count boards and HDI boards.

Dynamic Holding subsidiaries manufacture PCBs, high-layer-count boards and HDI boards.

High-speed cables within systems and between racks.

Optical transceivers, AOCs and custom optoelectronic modules.

High-precision planetary reducers for servo motion and automation.

Hinges and precision structures for phones and other mobile devices.

Driver and touch chips for industrial, mobile and other displays.

Heat pipes, vapor chambers and data-center liquid cooling.

Distribution of resists, developers, process chemicals, slurries, silicon wafers and other materials.