Companies, organized by role

Offshore transport and installation of turbines and foundations.

Array, export and dynamic cables with engineering services.

Published development, construction and operating activities; milestones are project-specific.

Published development, construction and operating activities; milestones are project-specific.

Published development, construction and operating activities; milestones are project-specific.

Published development, construction and operating activities; milestones are project-specific.

Thermal coal mining and marketing activities.

Power boiler products within the MHI group.

Gas-turbine or combined-cycle equipment offerings.

NOx, particulate and sulfur control systems.

Gas liquefaction, storage and export loading.

LNG vessel ownership, management and operations.

LNG carrier ownership, management and operation.

LNG carrier ownership, management and operation.

Published Taiwan LNG receiving and gas transmission activities.

Refining, naphtha cracking and basic petrochemicals

Refining, naphtha cracking and basic petrochemicals

Refining, naphtha cracking and basic petrochemicals

Refining, naphtha cracking and basic petrochemicals

Refining, naphtha cracking and basic petrochemicals

Refining, naphtha cracking and basic petrochemicals

Refining, naphtha cracking and basic petrochemicals

Gas-turbine or combined-cycle equipment offerings.

Published long-term gas plant service contracts.

Linkou coal reference and Tung Hsiao combined-cycle contract; distinguish project milestones.

High-tech facility construction, utilities and water-treatment engineering.

Owner and operating role at Linkou coal plant.

Tung Hsiao combined-cycle projects; the 2025 contract does not mean the new units are operating.

Coal ash and gypsum reuse information; listed as producer and manager.

Published Sun Ba phase 2 combined-cycle reference.

Zhong Neng onshore substation design, equipment, installation and testing.

Data-center power, HVAC and MEP system integration.

Transformers, switchgear, protection and grid connection.

Solar distribution transformers and PV BOX integration.

Thermal greases, pads and related interface materials.

TIM products for data center electronics.

Gap pads, fillers and thermal interfaces qualified for electrical and thermal conditions.

Published design and manufacturing for thermal modules.

Heat sinks for industrial PCs and other equipment.

Thermal modules integrating heat pipes and vapor chambers.

Annual report describes heat pipe and vapor chamber development and modules.

Annual report lists direct liquid cooling plates and series/parallel loops.

Annual report describes distribution, temperature monitoring and leak management.

Annual report lists CDU/RPU and sidecar configurations.

Fans, fan walls and AALC solutions.

Electronic cooling fans and AI server liquid-cooling solutions.

Design and manufacture of custom cold plates and loops.

CDU, manifold and cold-plate integration portfolio.

Shell DLC Fluid S3 propylene-glycol product.

Dielectric fluids, distinct from water-based cold-plate products.

Everis couplings; this CPC is not CPC Corporation, Taiwan.

Data center quick couplings and liquid cooling connections.

MC4 portfolio; this source does not establish junction-box supply.

RackChiller manifolds and hose whips.

In-house pump technology and CDU integration.

Liquid cooling monitoring and rack distribution equipment.

SmartPod EVO, not classified as a two-phase product.

Heat exchange and loop separation for data centers.

Data center chillers and cooling systems.

Customer manufacturing services spanning laser packaging, active alignment and system integration.

Optical manufacturing services include active and passive alignment, separate from own-brand fiber components.

Capabilities include optical alignment and assembly; a manufacturing role, not a material determination for a specific receiver model.

Precision optical packaging, alignment and manufacturing for customer products; contract revenue is not own-brand transceiver market share.

Laser packaging, active alignment and system integration; NVIDIA names it a photonics ecosystem partner but does not disclose every model's complete manufacturing allocation.

Laser packaging, active alignment and system integration; NVIDIA names it a photonics ecosystem partner but does not disclose every model's complete manufacturing allocation.

Publishes detachable optical connectors and a NVIDIA photonics collaboration; roles and volumes remain product-specific.

Public NVIDIA Photonics ecosystem participant supplying high-speed detachable fiber connectors; not a switch-ASIC or laser manufacturer.

Public NVIDIA Photonics ecosystem participant supplying high-speed detachable fiber connectors; not a switch-ASIC or laser manufacturer.

Publishes fiber arrays, passive optical subassemblies and related integration for optical modules and CPO.

Public fiber arrays, passive optical assemblies and packaging for CPO and high-speed modules; not all products are simply connectors.

Public fiber arrays, passive optical assemblies and packaging for CPO and high-speed modules; not all products are simply connectors.

Publishes InP substrates for communications lasers and detectors, rather than PD dies or complete receivers.

Publishes InP detector epitaxial structures; this page does not confirm each customer InGaAs absorber recipe.

Lists 1310/1550 nm InGaAs PIN dies and arrays, including 56G parts; specifications remain model-specific.

PD50Y1 explicitly lists InGaAs/InP, 200G PAM4 and die/carrier formats; a PD component role.

MARP-MP10A explicitly identifies InGaAs PIN; it establishes that component material, not a designated 200G or CPO receiver BOM.

Its 3.2T optical chipset announcement includes receiver TIAs; aggregate chipset rate is not a single PD bandwidth.

Supplies silicon-photonics starting wafers; subsequent photonic processes form Ge PDs and PICs.