Companies, organized by role

Fans, cooling modules and system cooling solutions.

Published thermal products and system cooling business; no specific orders inferred.

Vapor chambers, heat spreaders and liquid-cooling cold-plate modules.

Infrastructure including direct-to-chip liquid cooling and coolant distribution.

Modular power and infrastructure for high-density computing.

CoolChip CDU for cold-plate liquid cooling.

Mechanical, power, cooling and preintegration solutions.

Power, cooling, rack infrastructure and commissioning.

Data-center server power supplies and rack power solutions.

110 kW power shelf in a joint QCT showcase.

Ethernet and other communications and multimedia chips.

PC audio and USB control

LCD monitor scaler IC

RTL8396L and other Ethernet switch controllers; port counts and speeds vary by model.

Display-driver ICs and imaging-related chips.

Small display drivers explicitly list smartphone applications.

Notebook, monitor and tablet DDICs

Driver chips upstream of display panels and modules.

AndesCore processor and SoC platform IP for chip-design integration.

Chip-design and verification tools and semiconductor IP products.

Polished, epitaxial and other silicon wafers used as chip-manufacturing substrates.

Silicon wafer materials for semiconductors.

Polished, epitaxial, SOI and other silicon wafer specifications.

IC manufacturing for logic and specialty processes.

Photomask manufacturing and design-data processing services.

Integrated-circuit photomasks for different lithography requirements.

Developing, etching, stripping and cleaning chemicals for ICs and other electronics; operates separately from San Fu Gas.

Published electrodialysis recovery and subsidiary International Nitto investment.

Photoresists and related high-purity chemicals for semiconductor lithography.

DUV, EUV and other lithography systems for wafer pattern transfer.

Single-wafer, batch and other wet-process equipment; suitability depends on the model and process.

Etch systems for selective material removal and fine-feature formation.

CVD, ALD and other systems forming conductive and dielectric films.

Conductor, dielectric and selective etch products; capabilities depend on tool and layer.

Fast response, species pulsing and ion-energy control.

Cryogenic 3D NAND etch technology introduced in 2024.

Prevos, Selis and related products address selective material removal.

Deposition and other material-processing systems selected for the film and structure.

Equipment for implantation, annealing and related material-modification processes.

Chemical mechanical planarization systems for wafer-surface material removal and flattening.

Products such as Sym3 Z support three-dimensional device processing, not every etch application.

Plasma, ion-energy and angle control; capabilities depend on product version.

Purion implantation systems for different energies and applications.

Diamond discs condition polishing pads to maintain removal rates and uniformity; not complete CMP machines.

Semiconductor CMP pads and related consumables.

Defect inspection and metrology for wafers, masks and related processes.

Critical-dimension measurement, defect inspection and related data solutions.

DCR announced in 2024; this release does not establish named leading-node customers and volume-qualified layers.

Isotropic etch with rapid heating and cooling; evidence of product launch.

IC packaging and integration services selected for product requirements.

Wafer probing, final testing and system-level testing.

Publishes a CPO technology demonstration, not evidence of a particular customer volume receiver order.

aPPAK and other SiC/GaN packaging; no specific PSU customer is inferred.

Wire-bond, flip-chip, wafer-level and other packaging products and services.

Wafer-stage and post-packaging test services.

Wafer probing, final IC testing and burn-in services.

Integrated wafer testing, packaging and final-test services.

DRAM, NAND, NOR and MCP final test and related services.

Integrated wafer testing, packaging and final-test services.

Ethernet switch chips for enterprise, data-center, industrial and other markets.

Offers PAM4 optical DSPs for pluggable modules; these are chips, not finished modules.

Publishes optical driver and receiver chips, including an LPO chipset.

A component role, not a finished LPO module brand or a customer shipment claim.

Publishes high-speed TIAs selected for linearity, PD capacitance and interface requirements; not a PD absorber supplier.

Data-center, campus and other switches and network-management solutions.

Pluggable modules and compatibility information for network equipment; brand supply does not establish in-house manufacturing of every module.

G200 and other Silicon One switching processors for building switches.

Switches, EOS network operating systems and CloudVision management platforms.

Switch, router and other ODM solutions; official examples include integration of Broadcom chips.

Design and manufacturing solutions for high-speed data-center Ethernet switches.

Hardware platforms, design and manufacturing services, and open switches for cloud and other uses.

Operates the OneWeb LEO network, providing satellite capacity and connectivity.

Public service collaboration with Eutelsat OneWeb integrating satellite connectivity into communications solutions.

Satellite ground networks, tracking and control, and data-reception services.

Desmear, electroless copper and direct metallization for PCB, HDI and related processes.

An integrated wet-metallization process announced July 28, 2026; this is not a customer-shipment announcement.

Plating, etching and other chemicals for PCB and package-substrate manufacturing.