Companies, organized by role

DR4 500 m / DR4+ 2 km single-mode; typical 8 W.

70 m OM3 / 100 m OM4; see table for ambiguous source power wording.

Published 500 m DR8 and 2 km FR4; summary omits power.

OSFP DR8 maximum 25 W; product page omits reach.

400G lists up to 100 m; 800G reach is undisclosed.

Foxlink is named in the initiative; distinguish this from its AOC product role.

Server power, AC/DC, DC/DC and other power modules.

2026 CIOE exhibit announcement; reach and power undisclosed, no volume-production inference.

Catalog OSFP AOC specifies 30 m OM4; do not substitute standalone SR8 transceiver reach.

800G catalog examples reach up to 2 m, 4 m and 7 m respectively; power depends on version.

Eutelsat publicly commissioned Airbus to manufacture satellites for OneWeb constellation expansion.

Designs and manufactures Starlink satellites; operations and launch roles are listed separately.

Falcon 9 launch vehicles deliver payloads.

Designs and operates the Starlink constellation; satellite manufacturing and launch are separate roles.

Starlink connectivity services and terminals; availability follows official regional information.

Satellite platforms and space systems integrating attitude control, propulsion, power and other subsystems.

Microwave passive components for LEO satellite payloads.

Microwave passive components for ground stations; network operations are listed separately under ground-station network services.

Radiation-tolerant, radiation-hardened and other electronics for satellite payloads.

Develops small-satellite launch vehicles and launch-service capabilities.

Designs and manufactures satellite broadband equipment integrating antennas and RF systems.

User terminals for the Eutelsat OneWeb network.

OneWeb user terminals and satellite-tracking antenna solutions.

Millimeter-wave phased-array and satellite-communications antenna solutions.

GaAs RF IC processes; suitability depends on customer designs and product qualification.

GaAs RF IC manufacturing platforms for RF chip-design companies.

Satellite-communications RF signal chains and beamforming reference designs.

Annual reports describe satellite-communications boards and development of high-frequency, high-speed materials and processes.

Conventional multilayer, HLC, HDI, flexible and rigid-flex boards.

Conventional multilayer, HLC, HDI, flexible and rigid-flex boards.

Conventional multilayer, HLC, HDI, flexible and rigid-flex boards.

Conventional multilayer, HLC, HDI, flexible and rigid-flex boards.

Conventional multilayer, HLC, HDI, flexible and rigid-flex boards.

Zenfone and ROG Phone integrate computing, imaging, display and communications.

Laptops incorporating AI computing platforms.

Integration of direct liquid cooling, CDUs and racks.

ASUS computer products; no manufacturing partner inferred

ASUS computer products; no manufacturing partner inferred

Desktop motherboards

Finished computer monitors

PC power supplies; manufacturing partner not inferred

GPU card products, not GPU silicon fabrication

iPhone integrates hardware, operating systems and mobile applications.

Device payments and secure credentials, distinct from card issuing.

iPad products and published specifications

iPad CPU, GPU and neural engine integration; not merchant SoC sales

Compatible Apple Pencil products

Xiaomi, REDMI and POCO

Xiaomi, REDMI and POCO

Phone brand and product integration

Phone brand and product integration

Phone brand and product integration

Phone brand and product integration

TECNO, Infinix and itel

TECNO, Infinix and itel

Dimensity platforms integrate mobile computing and communications.

Designs processors and integrated platforms for phones and other devices; listed here for design.

Snapdragon platforms cover mobile computing, AI and connectivity.

Snapdragon and other platforms integrate computing, imaging and communications.

RF Fusion and other solutions integrate mobile RF front-end functions.

Standard and low-power DRAM; not a NAND storage manufacturer.

Develops, designs, manufactures and sells DRAM.

Flash, specialty DRAM and integrated memory.

Specialty and mobile DRAM; compare individual products.

NOR and SLC NAND code-storage products.

LCD and mobile displays supporting thin, touch-enabled and other designs.

2026 exhibition materials list RDL and GCS businesses; they do not confirm volume GCS shipments.

Public business and technical collaboration: GCS appears in 2026 exhibition materials, separately from existing FOPLP; volume shipments are unconfirmed.

LCD and advanced display technologies, panels and application solutions.

Development and validation: demonstrated GCS with Corning, with ongoing TGV, via metallization and reliability work; volume commercial shipments are unconfirmed.

Development demonstration: an August 31, 2026 announcement describes Corning glass and AUO RDL collaboration with ongoing reliability validation.

AUO Display Plus 3D tracking; not evidence of standalone module sales

AUO Display Plus: lenticular optics and eye tracking

AUO Display Plus touch options and optical bonding; not every AUO panel is touch-enabled

OLED display panels for smartphones.

Smartphone lenses and other optical products.

CMOS image sensors for mobile devices.

Battery packs for laptops, tablets, phones and other portable devices.

IT business publishes battery-module design support for notebook, tablet and smartphone customers.

Notebook packs; no named brand customer inferred

BQ25898 and other ICs manage lithium-battery charging and system power paths.

Battery monitoring, balancing and system-design support upstream of BMS integration.

MCUs, power management and GaN technologies used in publicly announced automotive-power collaboration.

BQ25898 and other charge controllers; IC specifications do not establish device charging time.

Mobile-phone pack resources provide fuel-gauge and related management solutions.

Published GaN PFC server PSU reference design.

Server PSU design resources and digital control.

Edge AI modules, inference systems and industrial computing equipment.

AI inference systems, modules, edge servers and gateways.

Data-center power, cooling and management solutions.

Data-center cooling and liquid-cooling solutions.

Data-center power supply and power management solutions.

Public automotive motor-drive and integrated power-system products.

EV OBCs and related integrated power products.

Automotive DC/DC converters and integrated systems.

AC and DC charging products, separately from on-board chargers.

2026 showcase of HVDC fans and thermal solutions.

2026 Rubin cold plate design showcase; not proof of volume production for every product.

Published liquid-to-liquid and liquid-to-air product ranges.

MGX racks with power and cooling infrastructure.

Rack power and 800 VDC designs.

Rack distribution and related infrastructure.

Published battery backup shelf products.

DC-to-AC conversion, MPPT and monitoring.

Integrates storage and energy management for project needs.

Published 5.5 kW redundant PSU with up to 97.5% efficiency under specified conditions.

Laptops with AI computing capabilities.

Collaborative robots integrating robot arms, vision and AI.

Industrial robots, single-axis robots and motion-control components.

The CRX family comprises collaborative robots.