Companies, organized by role

Phenolic resins for CCL and packaging, including curing agents for epoxy systems.

Copper foil for CCL, PCB, flexible circuits and IC substrates.

Copper foil for lithium-ion battery anode current collectors; this does not establish aluminum-foil supply.

Resins and engineering polymers

Resins and engineering polymers

Resins and engineering polymers

NORYL modified PPE oligomers for high-frequency, high-speed laminate formulations.

NORYL PPE blends

ULTEM PEI

NORYL SA reactive PPE oligomers

Glass-fiber fabric for PCB laminates.

Glass-fiber fabric for electronic circuit substrates.

PCB glass fabrics with different material properties.

Copper foil for circuit boards and packaging, including ultrathin products.

CCL and bonding sheets for electronic circuits.

Prepreg and copper-clad laminates for PCB manufacturing, listed as separate material roles.

370HR and other laminates and prepregs for PCB manufacturing.

Material families such as 370HR include both laminates and prepregs.

370HR epoxy FR-4 is a material example, not a confirmed PSU bill of materials.

High-frequency circuit substrate materials for aerospace, communications and other applications.

Multilayer boards, HDI boards and IC substrates.

Multilayer boards for dense routing and interlayer connections.

IC substrates connecting chip packages to system circuit boards.

Publicly documented ABF substrate production and yield-improvement work; supplies finished substrates.

Rigid, flexible, HDI, substrate-like and package-substrate products.

High-density interconnect and substrate-like boards with fine circuitry.

Flexible printed circuits for thin and bendable connections.

Boards for computing, communications, memory modules, servers and other equipment.

Conventional multilayer PCBs and other board types developed for specific applications.

Multilayer PCB manufacturing for a range of electronic equipment.

High-layer-count and high-speed board capabilities for computing.

High-density interconnect PCB technologies including microvias and sequential build-up.

Flexible and rigid-flex circuit boards.

PCB products and related manufacturing capabilities for commercial space.

High-layer-count boards focused on high-performance computing, AI servers and related uses.

HDI boards for dense, miniaturized electronic devices.

ABF substrates for high-performance processors.

IC and ABF package substrates; a different role from supplying ABF insulating film.

IC and ABF package substrates; a different role from supplying ABF insulating film.

Printed circuit boards and high-density interconnect boards.

IC substrates for logic, computing and memory chip packages.

High-density IC substrates for flip-chip packaging.

Develops and supplies Ajinomoto Build-up Film; downstream substrate manufacturing is listed under ABF package substrates.

CoWoS integrates logic chips, HBM and other components.

Integrates computing chips and HBM through CoWoS; not an HBM DRAM manufacturer.

COUPE integrates photonic and electronic chips for optical interconnects.

COUPE supports photonic and electronic integration; this listing represents a manufacturing platform rather than a finished engine brand.

Integrates EICs and PICs for optical engines and NVIDIA CPO platforms; a manufacturing and integration role, not a complete-switch brand.

Manufactures wafers to customer chip designs, with additional capabilities including advanced packaging.

CoWoS and other advanced packaging capabilities, listed separately as manufacturing and integration roles.

Supports PIC/EIC and engine integration through a manufacturing platform; not a switch-system brand.

Advanced logic cooperation announced by SK hynix; not an HBM DRAM manufacturer.

EMIB and Foveros are Intel packaging technologies, not CoWoS.

Silicon photonics products and technologies for data-center optical interconnects.

Research demonstrated at ECTC 2026 covers copper-filled TGVs, thermal-cycling reliability and large AI/HPC packages.

Publishes driver and TIA functions paired with silicon-photonics components.

Core processors for desktops and notebooks

Develops and manufactures stacked high-bandwidth memory.

Low-power DRAM, NAND and other memory products.

DRAM and HBM products and processes.

A representative NAND supplier; no universal module-brand supply relationship is inferred.

HBM products for AI and high-performance computing.

DRAM and storage solutions for mobile devices.

Designs and manufactures memory and storage products; listed here for manufacturing its own products.

DDR and related DRAM components.

A representative NAND supplier; no universal module-brand supply relationship is inferred.

Supplies HBM products, distinct from base-die foundry and package-integration services.

Galaxy smartphone families

DDR, LPDDR and GDDR product families.

A representative NAND supplier; no universal module-brand supply relationship is inferred.

Galaxy smartphone families

AI/HPC ASIC design and advanced-packaging integration services; not a general-purpose GPU brand.

Data-center GPUs and AI computing platforms.

DGX systems integrate GPUs, networking, power, cooling and other subsystems.

Quantum-X Photonics serves InfiniBand; Spectrum-X Photonics serves Ethernet. Their platform specifications must be read separately.

Accelerated computing, networking and software for AI factories.

AI Factory platforms cover accelerated computing, networking and software.

Jetson offers AI computing modules and development tools for edge devices.

Robotics AI computing, simulation and development platforms; not a robot-arm manufacturer.

Spectrum Ethernet switch chips and related SDKs; complete systems are listed separately.

Supplies switch systems including Spectrum, separately from its chip-design role.

Vision AI models, tools and deployment capabilities from edge to cloud.

Quantum-X Photonics and Spectrum-X Photonics are separate switch platforms with distinct specifications.

MGX and NVL compute and switching architecture.

Defines in-rack accelerator connectivity and switching.

Instinct accelerators for AI training, inference and high-performance computing.

Desktop and notebook processors

Design, manufacturing and integration of enterprise servers, storage and data-center systems.

Quanta subsidiary QCT publishes liquid-cooled AI rack solutions.

Quanta subsidiary QCT jointly demonstrated a rack platform with LITEON.

Notebook

Servers and rack solutions for cloud, AI and edge computing.

AI computing servers and rack integration solutions.

Server and rack integration for data-center computing.

Published liquid-cooled rack, power and interconnect integration.

Foxconn Group AI servers, computing trays, racks and system integration services.

NVIDIA publishes a Spectrum-X Photonics switch system integration role, separate from laser and ASIC manufacturing.

Foxconn subsidiary Ingrasys publishes GB300 NVL72 solutions.

Foxconn subsidiary Ingrasys GB300 NVL72 solution.

NVIDIA identifies Foxconn's integration of Spectrum-X Photonics switches into rack-ready systems; listed for system manufacturing and integration.

NVIDIA identifies Foxconn's integration of Spectrum-X Photonics switches into rack-ready systems; listed for system manufacturing and integration.

Optical engines and related optical-interconnect technologies for CPO architectures.

Co-packaged optics platforms integrating switch ASICs and optical engines.

Tomahawk, Jericho and other switching and routing chips.

Publishes its own CPO switch platform; assess the particular product rather than combining different vendors specifications.

The LPD3030 brief identifies a 28 Gb/s InGaAs PIN; this does not establish PD materials across Broadcom CPO products.

External pluggable laser sources for CPO and related architectures.

TOSA transmitter components incorporating DFB lasers.

Publicly described high-power InP continuous-wave lasers and ELS products, with demonstrations integrating silicon-photonics CPO.

1.6T-DR8 OSFP, 800G-DR4 and other transceivers; listed separately from laser and CPO components.

Demonstrated ELS using its InP CW lasers in 2026; a demonstration does not establish customer volume shipments.

Public InP CW laser, ELS and CPO demonstrations; laser components, ELS modules and optical engines are different product levels.

EMLs serve pluggable modules; CW lasers can support silicon-photonics transceivers and CPO, subject to device specifications.

Publishes UHP lasers and ELSFP light-source solutions for CPO, distinct from data transceivers.

UHP lasers can be integrated into ELSFP sources for CPO silicon-photonics engines; these are not complete pluggable data transceivers.

Fiber arrays and precision fiber-connection components.

Publicly offers custom transceivers and fiber-component integration; this does not establish 800G/1.6T market share or production scale.

Publishes fiber coupling for silicon photonics/CPO; this role does not establish Ge or InGaAs PD fabrication.

Precision fiber components and custom co-packaged-system integration; this does not identify FOCI as a designated NVIDIA Quantum-X supplier.

Data-center optical fiber, connectivity and cabling solutions.

Public TGV-glass products and a GCS demonstration with AUO; collaboration sources are provided in the topic references.

Named by NVIDIA and publicly collaborating with Broadcom on internal CPO fiber connections; listed for fiber and connection systems.

NVIDIA identifies SPIL's chip-level packaging, precision assembly and testing role; an interposer position label does not establish all interposer-manufacturing steps.

A published NVIDIA optical packaging and test role; not a claim to perform every interposer process.

NVIDIA identifies SPIL's chip-level packaging, precision assembly and testing role; an interposer position label does not establish all interposer-manufacturing steps.

Public CPO directions include FAUs, fiber harnesses, routing modules and ELS optics; optical assembly is not laser-die manufacturing.

Publishes FAUs, fiber harnesses and optical assembly components; this does not establish laser-die fabrication.

Public CPO directions include FAUs, fiber harnesses, routing modules and ELS optics; optical assembly is not laser-die manufacturing.

400G, 800G, 1.6T and other transceivers for AI and data-center links; also searchable through Zhongji Innolight.

Named by NVIDIA as a pluggable-transceiver company and included in LightCounting's March 2026 optical-communications update.